SANTA MONICA, Calif., Feb. 01, 2018 (GLOBE NEWSWIRE) --
DesignCon 2018, the nation’s biggest event for chip, board and systems engineers, today announced the winner of its prestigious Engineer of the Year Award, Dr. Mike Peng Li, Intel Fellow and the technologist for high-speed I/O and interconnects in the Programmable Solutions Group at Intel Corporation. The Engineer of the Year Award recognizes elite ability and accomplishments in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity. As this year’s winner, DesignCon will bestow a $10,000 grant to the educational institution of Dr. Li’s choice in his name.
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Finalists for the Engineer of the year award were selected by the editors of Design News, and the winner was voted on by the DesignCon community. The award was presented on Thursday, February 1st at DesignCon 2018. To learn more about the award, please visit: designcon.com/santaclara/awards
“The Engineer of the Year Award recognizes an individual who has made substantial contributions to the field of engineering, and we are happy to recognize Dr. Mike Peng Li for his lifelong commitment to supporting innovation and discovery in this field,” said Naomi Price, conference content director, UBM. “Throughout his illustrious career, Dr. Li has continually pushed the envelope on industry standards across multiple topics, including Ethernet and PCI Express, and is an extremely deserving recipient of this award.”
“DesignCon has emerged as one of the primary technical conferences on signal integrity and high-speed I/O for chips, boards, and systems over the years and I am honored to receive such acknowledgement,” said Dr. Li.
About Dr. Mike Peng Li
Dr. Mike Peng Li is a distinguished scientist and technologist. Dr. Li has contributed extensively to industry standards during his career, including PCI Express, Ethernet, Optical Internetworking Forum, Fibre Channel and Serial ATA. His participation in standards-setting efforts and conferences sponsored by the Institute of Electrical and Electronics Engineers (IEEE) includes serving on and chairing various technical committees and working groups. He has also published widely, including 70-plus papers on high-speed circuits and systems, modeling, simulation, and test and measurement; 40-plus papers on high-energy solar and astrophysics; and several books and book chapters on jitter and high-speed testing, modeling and analysis. He also holds more than 30 patents in high-speed architecture, circuits and systems, test and measurement, and modeling and simulation, with additional patents pending.
Currently, Dr. Li is an Intel Fellow and the technologist for high-speed I/O and interconnects in the Programmable Solutions Group at Intel Corporation, serving as the group’s technical expert and adviser in high-speed link technology; standards; SerDes architecture; electrical and optical signaling and interconnects; silicon photonics integration; optical field-programmable gate arrays (OFPGAs); and high-speed simulation, debug and test for jitter, noise, signaling and power integrity.
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About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at:
www.designcon.com. DesignCon is organized by UBM plc. UBM is the largest pure-play B2B Events organizer in the world. Our 3,750+ people, based in more than 20 countries, serve more than 50 different sectors. Our deep knowledge and passion for these sectors allow us to create valuable experiences which enable our customers to succeed. Please visit
www.ubm.com for the latest news and information about UBM.
Photos accompanying this announcement are available at
http://www.globenewswire.com/NewsRoom/AttachmentNg/88312c37-15db-42fa-817c-ca8a7f51f99d
http://www.globenewswire.com/NewsRoom/AttachmentNg/d0286dae-fa8b-4760-ab17-3a032ae3bdf6
