• The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with Synaptics AudioSmart AVS solution
• InvenSense high performance microphones offer high SNR and very low power at a frequency bandwidth up to 20kHz

SAN JOSE, Calif. — (BUSINESS WIRE) — October 24, 2017 — TDK Corporation announces that Synaptics will showcase their AudioSmart solution for Amazon Voice Services, using InvenSense high performance MEMS microphones, at the 2017 TDK Sensor Developers Conference in Santa Clara on Oct 23^rd and 24^th.

The ICS-40212 and ICS-40720 analog output and the ICS-41350 PDM digital output MEMS microphones are approved for use with the Synaptics AudioSmart AVS solution. These microphones offer high SNR and very low power at a frequency bandwidth up to 20kHz. High performance microphones are key in enabling voice based services that are now becoming commonplace in many homes. TDK microphones feature high signal to noise ratio (SNR) and very low power at a frequency bandwidth up to 20kHz. The TDK and Synaptics technology combined are enabling smart speakers, home hubs, and Internet of Things (IoT) applications to achieve their full potential.

“We are excited that our high-performance MEMS microphone solutions have been included with the Synaptics silicon- and software-based AudioSmart solution to enhance, enrich and expand user experience in the home speaker and IoT market,” said Kieran Harney, managing director, audio products, TDK. “We are pleased to welcome Synaptics to present the TDK/Synaptics solution at the TDK Sensor Developer Conference.”

“Synaptics is excited to be part of the TDK Sensor Developers Conference where we can showcase our innovations that help proliferate the expansion of voice-enabled devices,” said Saleel Awsare, vice president and general manager, audio and imaging business, Synaptics. “The combination of our voice and speech processing solutions with TDK’s market leading high-performance MEMS microphones will help device manufacturers quickly bring their voice-enabled solutions to market.”

InvenSense ICS-40212, ICS-40720, and ICS-41350 MEMS microphone solutions will be showcased at the 2017 TDK Sensors Developers Conference to be held October 23-24, 2017 at the Santa Clara Marriott, in Santa Clara, California, USA. The conference focuses on the “World of Sensors” and will share the latest InvenSense motion and sound product portfolio and introduce new sensor companies from the TDK group. TDK, EPCOS, ICsense, TDK-Micronas, and Tronics, will accompany InvenSense to highlight their solutions and together represent TDK, showcasing a variety of new sensor products and solutions. To schedule press and partner meetings for the complete TDK group at the show, contact  pr@invensense.com. For additional information about the InvenSense MEMS microphone solutions, please visit www.invensense.com or contact InvenSense Sales at sales@invensense.com.

Glossary

• MEMS: Micro Electrical Mechanical Systems
• SNR: Signal to Noise Ratio
• PDM: Pulse-Density Modulation

Key applications

• ICS-40212:
  • Home Speakers
  • IoT Devices
  • Smartphones, Tablets, Smart Watches
  • Wearables, Activity Monitoring
  • Always-on Listening
• ICS-40720:
  • Home Speakers
  • Teleconferencing Systems
  • Digital Still and Video Cameras
  • Security and Surveillance
  • Microphone Arrays
  • Voice Control and Activation
• ICS-41350:
  • Home Speakers
  • Smartphones, Tablets, Notebook PCs
  • Microphone Arrays
  • Cameras, Bluetooth Headsets
  • Security and Surveillance
  • Always-on Listening