(BUSINESS WIRE) — September 12, 2017 — Rambus Inc. (NASDAQ: RMBS):
What: |
TSMC Open Innovation Platform (OIP) Ecosystem Forum | ||
Who: |
Rambus Inc. (Nasdaq: RMBS) |
||
Where: |
Booth 916 | ||
Santa Clara Convention Center | |||
5001 Great America Parkway | |||
Halls C and D | |||
Santa Clara, Calif. 95054 | |||
When: |
Wednesday, Sept. 13, 2017 | ||
Rambus will be demonstrating its high-speed SerDes IP Cores at the TSMC Open Innovation Platform (OIP) Ecosystem forum this week in Santa Clara, Calif.
Additional details
Rambus Multi-protocol SerDes PHY
- The demonstration will showcase the Rambus Multi-protocol SerDes PHY, a state-of-the-art serial link subsystem that delivers enterprise-class performance across challenging signaling environments typically found in networking and server systems. Specifically, the signaling demonstration will feature the Rambus 28G multi-modal SerDes PHY at 28Gbps on TSMC 28nm. The solution spans a range of performance – from 1.25 to 28 Gbps – and features application-specific optimization through an efficient, scalable architecture.
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