The Command Center is used to create and solve variants of a FloTHERM model. This enables a complete understanding of the product design space and allows the thermal engineer to make informed design decisions. Automatic design optimization tools can be deployed in Command Center to systematically design aspects of the product. The Command Center also supports calibration tasks using T3Ster® thermal characterization-based models for even more accurate thermal simulations.
"I find the Command Center indispensable for running the many scenarios that I need to make sure that I do not just have a working design, but the best working design possible for my circumstances," said Wendy Luiten, thermal design, electronics cooling specialist, at Wendy Luiten Consultancy.
The new functionality in the Command Center tool is based on customer feedback for usability and productivity and introduces several critical features that make scenario definition and design space exploration intuitive and fast: easy-to-find objects, attributes and settings; "find" tool with multiple applications for variant creation; easy interaction with spreadsheet tools; and efficient simulation of hundreds of models.
Additional FloTHERM product features
The new FloTHERM release provides additional features for productivity and accurate thermal simulation, including:
- Support for Phase Change Materials (PCM). Encapsulated PCMs have become a common thermal solution for consumer applications, and have been difficult to simulate in the past. FloTHERM now accepts latent heat and melt temperature as inputs and utilizes these values automatically in transient applications. The impact of PCMs on component and touch temperatures can now be fully explored and optimized in FloTHERM.
- Industry standard ODB++ data can now be used to bring printed circuit board (PCB) designs into FloTHERM. FloTHERM will now fit alongside any PCB layout tool in the design flow.
- Blind and buried vias are fully supported in PCB model definition. This greatly improves results accuracy when conduction into the PCB is on the critical heat flow path.
- Improved parallel solver that produces faster and more scalable results for a broader range of applications.
"Our new FloTHERM product with Command Center addresses the thermal design challenges of today's advanced products, with automated features to make ideal design decisions for optimal product performance with confidence," stated Roland Feldhinkel, general manager of the Mentor Mechanical Analysis Division.
Product availability
The new FloTHERM product with Command Center is available now. For additional product information, go to:
www.mentor.com/products/mechanical/flotherm/
Contact for journalists
Larry Toda
Phone: 503-685-1664; E-mail:
Larry_Toda@mentor.com
Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world's most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: http://www.mentor.com.
Mentor Graphics, Mentor, FloTHERM, and T3Ster are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owner.
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SOURCE Mentor, a Siemens business
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