BANNOCKBURN, Ill., USA - February 16, 2017 — In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Pauls has served as an active volunteer and leader for IPC and the electronics manufacturing industry for nearly 30 years. Presently, he is chair of the Conformal Coating Requirements Task Group and had served as General Chairman of IPC’s Cleaning and Coating Committees for 10 years and has led IPC efforts in bare board cleanliness, solder mask, surface insulation resistance (SIR), chemical characterization, conformal coating, cleaning processes, and materials and process compatibility testing.

In addition, he has served as a U.S. representative to ISO and IEC working groups on SIR and electro-migration reliability standards. He has also participated in numerous national and international consortia on electronics manufacturing materials and processes. He was an instrumental contributor to IPC-CC-830, Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies as well as the development and revision of the IPC handbook on conformal coating, IPC-HDBK-830, Guidelines for Design, Selection, and Application of Conformal Coatings.

In 1997, Pauls earned an IPC President’s Award for his contributions to IPC standards development, and in 2012 was elected to chair IPC’s top standards development oversight committee, the Technical Activities Executive Committee for a two-year term.

"IPC is privileged to have Doug as such an active member of so many committees and deeply experienced with technical issues that impact our industry," said John Mitchell, IPC president and CEO. "This Hall of Fame tribute is in recognition of all his years of diligent volunteer work, helping to advance the electronics industry and IPC."

For more information on the IPC Hall of Fame and other awards presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871 or Email Contact.

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,900 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.



Contact:

Sandy Gentry
IPC Communications Manager
+1 847-597-2871
Email Contact

ANNOCKBURN, Ill., USA, February 16, 2017 — In recognition of his
extraordinary contributions to IPC and the electronics industry, Doug
Pauls, principal materials and process engineer, Rockwell Collins, was
honored with the IPC Raymond E. Pritchard Hall of Fame Award.
Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego
Convention Center, the IPC Hall of Fame Award represents IPC's highest
level of volunteer recognition.

         Pauls has served as an active volunteer and leader for IPC
and the electronics manufacturing industry for nearly 30 years.
Presently, he is chair of the Conformal Coating Requirements Task
Group and had served as General Chairman of IPC’s Cleaning and Coating
Committees for 10 years and has led IPC efforts in bare board
cleanliness, solder mask, surface insulation resistance (SIR),
chemical characterization, conformal coating, cleaning processes, and
materials and process compatibility testing.

In addition, he has served as a U.S. representative to ISO and IEC
working groups on SIR and electro-migration reliability standards. He
has also participated in numerous national and international consortia
on electronics manufacturing materials and processes. He was an
instrumental contributor to IPC-CC-830, Qualification and Performance
of Electrical Insulating Compound for Printed Wiring Assemblies as
well as the development and revision of the IPC handbook on conformal
coating, IPC-HDBK-830, Guidelines for Design, Selection, and
Application of Conformal Coatings.

         In 1997, Pauls earned an IPC President’s Award for his
contributions to IPC standards development, and in 2012 was elected to
chair IPC’s top standards development oversight committee, the
Technical Activities Executive Committee for a two-year term.

"IPC is privileged to have Doug as such an active member of so many
committees and deeply experienced with technical issues that impact
our industry," said John Mitchell, IPC president and CEO. "This Hall
of Fame tribute is in recognition of all his years of diligent
volunteer work, helping to advance the electronics industry and IPC."

For more information on the IPC Hall of Fame and other awards
presented at IPC APEX EXPO, contact Sandy Gentry, IPC communications
manager, at  +1 847-597-2871  or  SandyGentry@ipc.org .



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About IPC

IPC ( www.IPC.org ) is a global industry association based in
Bannockburn, Ill., dedicated to the competitive excellence and
financial success of its 3,900 member companies which represent all
facets of the electronics industry, including design, printed board
manufacturing, electronics assembly and test. As a member-driven
organization and leading source for industry standards, training,
market research and public policy advocacy, IPC supports programs to
meet the needs of an estimated $2 trillion global electronics
industry. IPC maintains additional offices in Taos, N.M.; Washington,
D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow,
Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and
Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.