Keysight Technologies, Molex, Anritsu Co. and others provide sneak peek of news ahead of January 31-February 2 event in Santa Clara, CA

SAN FRANCISCO, Jan. 23, 2017 — (PRNewswire) —  Today, DesignCon previews announcements from more than 50 exhibitors participating at the event next week. DesignCon, the premier educational conference and technology exhibition for electronic design engineers in the high-speed communications and semiconductor communities, will present three days of deeply technical sessions, special events and a robust expo hall hosting the industry's leading solution providers. Via the expo hall, attendees will have the opportunity to experience emerging solutions first hand and connect with leading companies on what's to come.

DesignCon will take place January 31 – February 2 at the Santa Clara Convention Center. For additional information and to register, please visit: designcon.com

Below is a preview of announcements exhibitors will showcase at DesignCon 2017: 

3M (booth 514) announces Twin Axial Cable Assemblies that bring incredible flexibility in an ultra-thin, space-saving form. Featuring a low-profile ribbon design with a remarkably tight bend radius, it can help save substantial space inside congested systems, allowing for optimal airflow and cooling to maintain the speeds and power your system demands.

Anritsu (booth 633) will display signal integrity solutions featuring its Signal Quality Analyzer MP1800A BERT, VectorStar® and ShockLine™ VNAs. Demos include a 56G/112 NRZ and PAM4 Accurate Jitter Tolerance Test System that satisfies communications standards such as OIF, IEEE, and InfiniBand.

Applied Simulation Technology (booth 1149) introduces Mesh Gnd module for accurate modeling of flex circuits and other mesh ground/power structures on PCBs. Mesh Gnd is a new feature set of ApsimRLGC 2D+ field solver. ApsimRLGC now also expands its capability by adding an optimizer which helps synthesize trace parameters for ZO optimization.

Artek, Inc. (booth 309) will be introducing all new, all passive & tunable ISI, XTalk, Tr/Tr, Skew controllers for receiver physical layer tolerance testing.

Bellwether (booth 652) will showcase both Hi Speed & Hi Power connectors and cables. Cable such as SlimChroma™ can be used to meet USB 3.0/3.1 signal integrity requirements. Connectors such as CrystalBand™ can provide excellent connectors capable of handling high electrical current in small space.

Benchmark Electronics (booth 301) announces expanded RF development capabilities and is showcasing their latest innovations in electronics design expertise. Benchmark services have been providing advanced product engineering and manufacturing solutions in high-speed computing, telecommunications and related industries for over a quarter century.

Cadence (booth 515) will show how designers can optimize signal and power integrity design and analysis as well as get support for designing with the PCIeÒ 4.0 interface.

EDADOC USA (booth 518) will showcase new service offerings for turnkey solutions in addition to their high-speed PCB design capabilities.

EMSCAN (booth 211) significantly improves the speed and the resolution (0.06 mm) of the world's fastest EMC/EMI scanner: the EMxpert ERX+. Now PCB and design engineers can diagnose EMC/EMI issues on a 2.25 cm x 2.25 cm (0.89" x 0.89") sized PCB at 0.1 mm in less than 9 minutes.

Feinmetall (booth 1153) is proud to introduce its new RF HF66 series for reliable contacting of SMD assembled RF mini connectors and new coaxial high current 1860 series suitable for formation/test of Li-ion cells, quality control of batteries/power storage and charging, and discharging processes of batteries.

Hitachi Cable America (booth 811) will showcase new product and service offerings including Direct Attach Cables (DAC), DensPac, ACC and more.

HSIO Technologies (booth 423) has a new line of Zero Footprint Sockets that incorporates a device size socket footprint with industry standard spring pins. These small test sockets allow a customer to place them into any end application allowing a Spring Pin socket to be directly re-flowed into the same location as the device.

Huwin (booth 1152) will introduce a new USB 3.1 Type C test solution. It contains test fixtures and a compliance test software. The test fixtures have been optimally designed to measure any USB 3.1 Type C connectors using a commercial network analyzer.

Imagineering (booth 1240) announces it is now AS9100C Certified for printed circuit boards and Assemblies. This certification is an internationally recognized standard focused on quality requirements necessary in the Defense and Aerospace industry.

Ironwood Electronics (booth 752) introduces a new BGA socket family using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications (-55C to +160C). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).

Kandou Bus (booth 218), together with Keysight, will demonstrate the Glasswing Ultra-Short-Reach PHY that uses Chord Signaling to deliver sub-pico Joule per bit in-package communications. The PHY delivers 125 Gb/s over 6 data wires.

Keysight Technologies (booth 725) will demonstrate new test and measurement techniques for 400G/PAM-4 designs, data analytics, digital interconnect test and physical layer test and will provide complimentary workshops on these technologies. Keysight specialists will be available to discuss new services for calibration and technology refresh plus training and consulting.

Luxshare-ICT (booth 801) will be showcasing its OCuLink 4x Enhanced Vertical receptacle along with a 2 x 4x solution for x8 OCuLink applications. Luxshare's Type C, Power assemblies, Standard I/O, FFC/FPC, Power Bus Bar, Braided Copper Cables, SAS, PCIe, Magnetic Jacks, Active Optical Cables, and JDM Capabilities will all be available to discuss with its engineering team.

Micram (booth 658) launches new and enhanced features for its ultrafast 100 GS/s, 35 GHz bandwidth VEGA DAC4 signal generator, which now supports fully automatic synchronization of two and four channel configurations. Software enhancements include rational sampling, fully adjustable channel skew and predefined filters, pre-distortion, pre-compensation, noise cancellation, PAM-4/PAM-8 and other complex patterns.

Microlease (booth 222) will be leading hands on demonstrations with the latest test and measurement equipment from Keysight and Tektronix.

From the publishers of Microwave Journal comes an online journal specializing in signal integrity, power integrity, and EMC/EMI: Signal Integrity Journal (booth T2). The Editorial Advisory Board includes DesignCon luminaries Eric Bogatin (Editor), Bert Simonovich, Yuriy Shlepnev, Istvan Novak, Alfred Neves, Doug Smith, and Vladimir Dmitriev-Zdorov. Contributing: Janine Love & Patrick Hindle.

Molex (booth 619) will showcase versatile, high-density, space-saving connectivity solutions that are rapidly increasing network bandwidth is the crux of next-generation system architectures. Advancements in Molex technologies provide clear paths to adoption of higher data transmission rates that are in demand by manufacturers today.

National Instruments (booth 705) announces new higher performance model of VirtualBench with 500 MHz of analog bandwidth and 40 MHz sine output for higher performance benchtop and automated test applications. VirtualBench consolidates five of the most commonly used test and measurement instruments into one device without compromising performance, creating new efficiencies for engineers.