IPC Issues Call for Participation for IPC APEX EXPO 2017

BANNOCKBURN, Ill., USA, April 28, 2016 — IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Nokia, Ericsson, Indium, Flextronics, Intel and MacDermid have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

3D Printing in Electronics Manufacturing
Automation in Electronics Manufacturing
Adhesives
Advanced Technology
Area Array/Flip Chip/0201 Metric
Assembly and Rework Processes
BGA/CSP Packaging
Black Pad and Other Board Related Defect Issues
BTC/QFN/LGA Components
Business & Supply Chain Issues
Cleaning
Conformal Coatings
Corrosion
Counterfeit Electronics
Design
Electromigration
Electronics Manufacturing Services

Embedded Passive & Active Devices
Environmental Compliance
Graphene in Electronics Manufacturing
Lean Six Sigma
LED Manufacturing
Failure Analysis
Flexible Circuitry
HDI Technologies
Head-on-Pillow
Board and Component Warpage
High Speed, High Frequency & Signal
Industry 4.0
Integrity
Lead-Free Fabrication, Assembly & Reliability
Miniaturization Nanotechnology Optoelectronics
Packaging & Components

PCB Fabrication
PCB and Component Storage & Handling Performance
Quality & Reliability
Photovoltaics
PoP (Package-on-Package)
Printed Electronics
Reshoring
RFID Circuitry
Robotics
Soldering
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
2.5-D/3-D Component Packaging
Underfills
Via Plugging & Other Protection
Wearables

A 200-400 word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. In addition, course proposals are solicited from individuals interested in presenting half-day or full-day professional development courses on design, lead-free technologies, manufacturing processes, process improvement, materials, test and reliability.

Technical conference paper abstracts are due June 17, 2016 and course proposals are due August 5, 2016. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.

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About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.