TOKYO — (BUSINESS WIRE) — March 29, 2016 —
Toshiba
Corporation's (TOKYO:6502) Semiconductor & Storage Products Company
today announced the addition of new packages to its line-up of
new-generation highly efficient transistor arrays, the “TBD62064A
series” and “TBD62308A series” with DMOS FET[1] type sink-
output[2] driver, that have found wide application, including
in motor and relay drives.
The new products, “TBD62064AFAG” and
“TBD62308AFAG” are packaged in “SSOP24” surface-mount type, standard
packages. Mass production starts today.
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Toshiba:DMOS FET transistor arrays "TBD62064AFAG" with 1.5A sink-output driver. (Photo: Business Wire)
Following some reports from customers, Toshiba analyzed handling of the HSOP type surface-mount packages that it uses in its in-line packages, and has found that there can be difficulties with the flow of solder to the heat radiating fins during board mounting. In response, Toshiba has developed an SSOP type package with the same heat dissipation performance as the HSOP package. The SSOP has standard 1mm-pitch pins without the heat radiating fins, and achieves easy board mounting.
The new products are equipped with 4 channels of 50V/1.5A rated output, suitable for driving constant voltage unipolar stepping motors.
Toshiba adopted DMOS FET output drivers for its new products to secure the high efficiency customer requires to reduce power loss—DMOS FET do not require a base current, and can accept high current density per device area, keeping on-resistance low.
Main Features of New Products
-
High efficiency drive
"TBD62xxxA series" transistor arrays cut power loss by about 38%[3] compared with the "TD62xxxA series". -
High-voltage, large-current drive
The absolute maximum rating of the output is 50V/1.5A. -
Packages to suit various needs.
The line-up includes DIP packages, where there is strong demand from the hobby goods, amusement and industrial equipment fields, and SSOP/HSOP packages that support high current (1.5A) drives and surface mounting
Applications
Amusement equipment (pachinko and slot machines), home appliances (air conditioners and refrigerators) and industrial equipment (vending machines, banking terminals such as ATMs, office automation equipment, and factory automation equipment)
Comparison with in-line product |
||||||
In-line product
|
New-generation product
|
New-generation product
|
||||
Output block device | Bipolar transistor | DMOS FET | DMOS FET | |||
Wafer manufacturing technology | Bipolar process |
BiCD process
Future standard technology |
BiCD process
Future standard technology |
|||
Package |
FG type : HSOP16
PG type : DIP16 |
FG type : HSOP16
PG type : DIP16 |
SSOP24 | |||
Pin assignment | Same pin assignment | New | ||||
Function | Same function | Same function | ||||
Others |
|
|
Product line-up |
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Product name |
Output
type |
Output
channel |
Output | Common |
VIN(ON)
|
Package |
Mass
production |
Equivalent
in-line product |
||||||||||
TBD62064A | FG | Sink output | 4ch |
50V
1.5A |
Built-in | 2.5V to 25V | HSOP16 | March 2016 | TD62064AFG | |||||||||
PG | DIP16 | TD62064APG | ||||||||||||||||
FAG | SSOP24 | - | ||||||||||||||||
TBD62308A | FG | Sink output | 4ch |
50V
1.5A |
Built-in | 0V to Vcc-3.5V | HSOP16 | March 2016 | TD62308AFG | |||||||||
PG | DIP16 | TD62308APG | ||||||||||||||||
FAG | SSOP24 | - | ||||||||||||||||