BANNOCKBURN, Ill., USA, March 22, 2016 — IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
For their significant contributions to the 2015-2016 IPC APEX EXPO Technical Program Committee, Eric Bastow, Indium Corporation; Beverley Christian, Ph.D., ABC Electronics Manufacturing Consulting; and Russell Nowland, Nokia, earned a Special Recognition Award. For their contributions to the Technical Program Committee, Michael Beauchesne, BAE Systems; Steve Butkovich, Zollner Electronics; Gary Ferrari, FTG Circuits; Dennis Fritz, MacDermid Enthone Electronics Solutions; Patricia Goldman, I-Connect 007; David Hoover, TTM Technologies; R. Wayne Johnson, Ph.D., Tennessee Tech University; Todd MacFadden, Bose Corporation; Alan Rae, Ph.D., Incubator Works; Karl Sauter, Oracle America, Inc.; and Jeff Schake, Advanced Print Technologies Printing Solutions ASM Assembly Systems, earned a Distinguished Committee Service Award.
For his leadership of the D-64 Subcommittee that developed IPC/JPCA-6901, Application Categories for Printed Electronics, Dan Gamota, Ph.D., Printovate Technologies, Inc., earned a Committee Leadership Award.
For their leadership of the 4-14 Subcommittee that developed Amendment 1 to IPC-4556, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards, George Milad, Uyemura International Corp. and Gerard O'Brien, Solderability Testing & Solutions, Inc., earned a Committee Leadership Award. For their significant contributions to IPC-4556, Amendment 1, Don Dupriest, Lockheed Martin Missiles & Fire Control; Donald Gudeczauskas, Uyemura International Corp.; Brian Madsen, Continental Automotive Systems; Mario Rosin, Atotech Deutschland GmbH; and Michael Wolverton, Raytheon Systems Company; earned a Special Recognition Award. For their contributions to IPC-4556, Amendment 1, Tina Barcley, TAS Consulting; Scott Bowles, L-3 Fuzing and Ordnance System; Matthew Byrne, BAE Systems Platform Solutions; Michael Haller, Fischer Technology Inc.; William Johannes, Sandia National Labs Albuquerque; Henry Lajoie, OMG Electronic Chemicals Inc.; Joseph McGurran, Atotech USA Inc.; Thi Nguyen, Ph.D., Lockheed Martin Missile & Fire; William Ortloff, Raytheon Company; Karl Sauter, Oracle America, Inc.; and David Sommervold, The Bergquist Company/Henkel Electronic Materials LLC, earned a Distinguished Committee Service Award.
For his leadership of the 5-11c Task Group that developed IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations, Nate Grinvalds, Rockwell Collins, earned a Committee Leadership Award.
For their leadership of the 4-34B Subcommittee that developed J-STD-609B, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes, Stephen Tisdale, Intel Corporation, and Lee Wilmot, TTM Technologies, earned a Committee Leadership Award. For their contributions to J-STD-609B, Beverley Christian, Ph.D., ABC Electronics Manufacturing Consulting; David Corbett, Defense Supply Center Columbus; Curtis Grosskopf, IBM Corporation; and Linda Woody, Linda Woody Consulting, earned a Distinguished Committee Service Award.
For his leadership of the D-64a Task Group in the development of IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics, Ken Gann, Lab Tech, earned a Committee Leadership Award.
For his leadership of the 2-18J Lab Report Declaration Task Group, William Haas, Seagate Technology (Retired), earned a Committee Leadership Award.
For their leadership of the 7-12 Microsection Subcommittee that developed IPC-TM-650, Method 2.1.1F, Microsectioning, Manual and Semi or Automatic Method, Randy Reed, TTM Technologies, and Russ Shepherd, NTS Anaheim, earned a Committee Leadership Award. For their contributions to Method 2.1.1F, Denise Chevalier, Amphenol Printed Circuits, Inc; Kelly Daniluk, NASA Goddard Space Flight Center; Caitlin Devaney, Crane Electronics, Inc.; Stefan Gerhold, Atotech Deutschland GmbH; Vicka Hammill, Honeywell Inc. Air Transport; Chris Mahanna, Robisan Laboratory Inc.; Matthew McQueen, NSWC Crane; Debora Obitz, Microtek – East; Joey Rios, Massachusetts Institute of Technology; and Ed Cuneo, Boeing Company (Retired), earned a Distinguished Committee Service Award.
For his leadership of the Environment, Health and Safety Committee, Lee Wilmot, TTM Technologies, earned a Committee Leadership Award.
For their leadership of the D-33at Task Group that developed IPC-6012D Training and Certification Program, Don Dupriest, Lockheed Martin Missiles & Fire Control, earned a Committee Leadership Award. For her significant contributions to IPC-6012D, Training and Certification Program, Renee Michalkiewicz, NTS Inc., earned a Special Recognition Award. For their contributions to the training program, Gary Ferrari, FTG Circuits; Chris Mahanna, Robisan Laboratory Inc.; Steven Bowles, L-3 Fuzing and Ordnance Systems, Cincinnati; Leo Lambert, EPTAC Corporation; Clifford Maddox, Boeing Company; and Alan Young, Jet Propulsion Laboratory, earned a Distinguished Committee Service Award.
For his leadership of the E-21 Subcommittee that developed IPC-1072, Intellectual Property Protection in Assembly Manufacturing, Raj Kumar, TTM Technologies, earned a Committee Leadership Award.
For his leadership of the 9-90 Committee, Design Council Executive Board that developed the Certified Interconnect Design and Advanced Certified Interconnect Design 2016 Certification and Training Program, Gary Ferrari, FTG Circuits, earned a Committee Leadership Award. For her significant contributions to the certification and training, Cherie Litson, Litson1 Consulting, earned a Special Recognition Award. For his contributions to the certification and training program, Andy Kowalewski, earned a Distinguished Committee Service Award.
For his leadership of the 7-24 Subcommittee that developed IPC-9121, Troubleshooting for Printed Board Fabrication Processes, Michael Carano, RBP Chemical Technology, Inc., earned a Committee Leadership Award.
Photos from the IPC APEX EXPO awards ceremonies are available at www.ipc.org/flickr.For more information on these awards or the award recipients, contact Sandy Gentry, IPC communications manager, at +1 847-597-2871.
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About IPC
IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Contact:
Sandy Gentry,
IPC Communications Manager
+1 847-597-2871
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