Leti to Present Solutions to New Applications Using 3D Technologies at SEMICON West LetiDay Event, July 14

Leti Experts also Will Speak at TechXPOT Session on MEMS and STS Session on Lithography Cost-and-Productivity Issues Below 14nm 

GRENOBLE, France – June 23, 2015 – CEA-Leti is hosting its 5th annual LetiDay San Francisco event, “Going Vertical with Leti: Solutions to new applications using 3D technologies”, during SEMICON West.  

In addition, Leti experts will share their insights on the MEMS market at TechXPOT North on July 14 and on lithography at the Semiconductor Technology Symposium (STS) on July 15.

The July 14 LetiDay event for invited guests is scheduled from 5-9 p.m. in the fourth-floor Social Terrace at the W San Francisco hotel, 181 3rd St.

Topics include:

  • Welcome: Leti's 3D integration for tomorrow's devices, Leti CEO Marie Semeria
  • CoolCubeTM: 3D sequential integration to maintain Moore's Law, Olivier Faynot, Leti Devices Department Manager
  • Photonics: why 3D integration is mandatory, Olivier Faynot
  • New non-volatile memory technologies, Hughes Metras, Vice President of Strategic Partnerships, North America
  • Computing: 3D technology for better performance, Severine Cheramy, 3DIC Laboratory Manager
  • Lighting: 3D integration for cost effectiveness, I. C. Robin, Strategic Marketing Manager, Lighting
  • Nanocharacterization for 3D, Pierre Bleuet, 3D Imaging Expert
  • Conclusion: Silicon ImpulseTM, Marie Semeria

Leti presentations at general sessions:

TechXPOT South, 10:30 a.m. to 12:30 p.m., July 14. Hughes Metras, Leti vice president for strategic partnerships/North America, will speak at the session on  “What’s Next for MEMS”

Semiconductor Technology Symposium (STS), 10 a.m. to 12:30 p.m., July 15, Moscone North, Hall E, Room 133. Laurent Pain, Leti patterning program manager – business development in the Silicon Technologies Division, will speak at the session on  Making Sense of the Lithography Landscape: Cost and Productivity Issues Below 14nm and the Path(s) to 5nm . His topic is   The Leverage of Lithography Alternatives to Address High-end Technology Roadmap .

Visit Leti in the European Pavilion,  South Hall, Booth #2317,  during SEMICON West

About Leti (France)

As one of three advanced-research institutes within the CEA Technological Research Division, CEA Tech-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on www.leti.fr and @CEA_Leti.

Press contact

Agency        +33 6 74 93 23 47                               

Email Contact

Event contact                                                                                       

Email Contact



Read the complete story ...
Featured Video
Jobs
GPU Design Verification Engineer for AMD at Santa Clara, California
Sr. Silicon Design Engineer for AMD at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Upcoming Events
SEMICON Japan 2024 at Tokyo Big Sight Tokyo Japan - Dec 11 - 13, 2024
PDF Solutions AI Executive Conference at St. Regis Hotel San Francisco - Dec 12, 2024
DVCon U.S. 2025 at United States - Feb 24 - 27, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise