Seminars and Panel Discussions on Packaging Innovations at PACKEX in Montreal

SANTA MONICA, Calif., Oct. 30, 2014 — (PRNewswire) — Smart innovations changing packaging design is just one of the topics being covered at the PACKEX Montreal packaging conference sessions on November 20, 2014, at the Palais des Congres in Montreal. Fadi Rabbath, President of Gespro Packaging, will present new developments in intelligent and multi-function packaging. Oliver Campbell, Director of Procurement for Packaging and Packaging Engineering at Dell, will talk about sustainability and new materials, and their applications for packaging economics. And a panel of packaging experts will discuss opportunities in new market segments.  

In addition, at this two-day event, November 19-20, there will be conference sessions on 3D printing, as well as M2M machine-to-machine wireless technology in manufacturing. Workshops on the future of the plastics industry, will be presented by the Society of Plastics Engineers, (SPE). The workshops and conference sessions are taking place in conjunction with the PACKEX Montreal trade event, with suppliers showcasing packaging technologies and materials, and Expoplast, the event for the plastics industry, with primary processing equipment, mold making components, and other plastics resources.

Co-located with these shows are four other advanced manufacturing events under the same roof: Design & Manufacturing Montreal, ATX Montreal, PBS Montreal, and AeroCon.

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