See the latest technology on display at the premier annual event dedicated to signal integrity at all levels of electronic design, January 28-31, 2014 in Santa Clara, California

SAN FRANCISCO, Jan. 22, 2014 — (PRNewswire) —   UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package, and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technology and XPRIZE.  DesignCon has reinforced its commitment to STEM with two new initiatives including - a Next-Gen volunteer program geared toward students and emerging engineers, and will host a Bay Area Girl Geek Dinner on Thursday January 30^th.

(Logo:  http://photos.prnewswire.com/prnh/20140122/SF50983)

The DesignCon 2014 Technical Conference will feature more than 100 conference sessions organized under one of 14 tracks designed to address the latest developments in a range of industry-specific categories including: signal and power integrity, PCB design tools and methodologies, parallel and memory interface design, high-speed serial design, wireless and photonic design and integration, and jitter and crosstalk among many others.  To help attendees manage their time and priorities and make the most of their show experience, DesignCon is providing an interactive schedule builder that is compatible with the DesignCon Mobile App.  Available in iPhone/iPad, Android, and mobile web versions, the DesignCon Mobile App automatically populates with individuals' online Schedule Builder selections, as well as provides users with an attendee directory, exhibitor listings, location-based check-ins, badging, and Twitter and Facebook interactivity. 

With more than 150 exhibitors the DesignCon 2014 Expo will showcase a wide variety of cutting-edge high-speed design tools, technologies, and solutions for modeling and simulation, test and measurement, prototyping, analyzing, advanced packaging and more. 

Preview information about new products to be showcased at the DesignCon 2014 expo is available at the Virtual Press Office and several major new products, including a few from host sponsor Agilent Technologies, are scheduled to be announced at the show. 

Recent DesignCon Exhibitor Announcements include:

AtaiTec to Introduce Fixture De-embedding Tool and Signal Integrity Apps
Rogers Highlights Materials for High Performance Digital and Analog Circuits at DesignCon 2014
Get a Sneak Peak of Sigrity 16.63 at Cadence Booth #507
BEST Inc Develops Plastic Film Stencils for DIY'rs, Labs and Educational Institutions
Pickering Interfaces to Feature RF and Microwave Switching Solutions at DesignCon2014
Electronics Enhancements In ANSYS 15.0 Bring Increased Fidelity To Users
View All  

Additional DesignCon 2014 expo highlights include: free education, speed training, and product teardowns in the Chiphead Theater; the Agilent Education Forum; visionary keynotes from industry leaders at Intel, XPRIZE Foundation, and Micron Technology, Inc.; the DesignVision and Best in Test Awards; happy hour parties with free beer and snacks; and the DesignTOUR expo game, which provides participants with a chance to win one of 14 prizes, including: a $250 gift card, 32GB Kindle Fire HDX, 16GB Google Nexus 10, 40" Samsung Smart TV, and an Xbox One console bundle. 

DesignCon is supported by host sponsor Agilent Technologies, Corporate Sponsor Rambus, Diamond Sponsors Anritsu & Teledyne LeCroy, Platinum Sponsor Rohde & Schwarz and Gold Sponsor Sisoft.

Media and analyst registration is free and you can register now by visiting:  https://designcon.tech.ubm.com/2014/registrations/media

To stay up-to-date on the latest DesignCon 2014 program additions and news, please visit http://www.designcon.com/santaclara/ and follow DesignCon online via:

• Facebook: https://www.facebook.com/DesignCon 
• Twitter: @UBMDesignCon 
• LinkedIn: http://linkd.in/1gfaxOU 
• DesignCon Blog: http://blog.designcon.com/

About UBM Tech
UBM Tech is a global media business that brings together the world's technology communities through live events, online properties and custom services. UBM Tech's community-focused approach provides its users and clients with expertly curated research, education, training, community advocacy, user-generated content and peer-to-peer engagement opportunities that serve the Electronics, Security, Enterprise Communications, Network Infrastructure and Applications, Game and App Developers, and Tech Marketing communities. UBM Tech's brands include Black Hat, DesignCon, EE Times, Enterprise Connect, Game Developers Conference (GDC), HDI, InformationWeek, Interop and Light Reading. Create, a UBM Tech full range marketing services division, includes custom events, content marketing solutions, community development and demand generation programs based on its content and technology market expertise. UBM Tech is a part of UBM (UBM.L), a global provider of media and information services with a market capitalization of more than $2.5 billion. For more information, go to tech.ubm.com ; follow us on Twitter at @UBMTech.

For more information on DesignCon or UBM Tech please contact:

Christine Stieglitz, BtB Marketing Communications
919-872-8172 | Email Contact

Linda Uslaner, UBM Tech
516-562-5843 | Email Contact

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UBM Tech Web: http://tech.ubm.com