Compact Device Size Drives Smaller Camera Modules for New Car Camera Systems

SAN JOSE, Calif., Nov. 19, 2013 — (PRNewswire) —   Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announces sample shipments of its TCM5126GBA, a VGA 1/4 inch CMOS image sensor for automotive camera applications. The device combines a small chip-scale package (CSP) with through silicon via (TSV) ¹ technology for a 30 percent size reduction compared to equivalent products ². The ultra-compact image sensor will drive smaller camera modules for rear viewing in parking assist systems, surround view systems and side view systems in new car models.

"The automotive industry has a keen focus on driver safety, as such there will be a dramatic increase in the number of cameras in new cars," says Andrew Burt, vice president of the Image Sensor Business Unit, System LSI Group at TAEC. "We see a minimum of two cameras being planned for rear and forward viewing. The TCM5126GBA enables a physically smaller camera module that supports both functions for back up camera viewing, rear crash detection, and forward crash sensing."

The TCM5126GBA delivers 60fps (full resolution) image quality. It integrates a high dynamic range (HDR) function that reproduces superior image quality of objects backlit by the sun or vehicle headlights. The sensor also incorporates a picture-flip function that can horizontally and/or vertically flip output images, an on-screen display function that outputs preliminary set parking guidelines together with the image, and a zoom function for use in rear view cameras in parking assist systems. A built-in timer function sustains images when the transmission is shifted from reverse to forward, allowing drivers to see a continuous video stream when backing into a parking space. The stand-alone operation support (SAOS) function enables automatic operation when power is supplied without external microcontrollers, also contributing to the design simplification of automotive view camera systems.

Availability

Sample shipments of the TCM5126GBA are currently available. Mass production is scheduled to start in June 2014.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jspor from your TAEC representative.

Note:
1: Through Silicon Via (TSV) is the technology that shapes small through halls on the backside of the chip and forms electrode.
2: Comparison with "TCM5114PB".

SOURCE Toshiba America Electronic Components, Inc.

Contact:

Toshiba America Electronic Components, Inc. Web: http://www.toshiba.com/taec