STMicroelectronics LSM303D 6-axis Electronic Compass - Reverse Costing Analysis

DUBLIN, November 18, 2013 — (PRNewswire) —

Research and Markets ( http://www.researchandmarkets.com/research/sl83ms/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM303D 6-axis electronic compass - Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

System Plus Consulting is proud to publish the reverse costing report of the new 6-Axis electronic compass supplied by STMicroelectronics.

The LSM303D is a system-in-package featuring a 3-axis magnetometer and a 3-axis accelerometer. With a 3x3x1mm package size, it belongs to the smallest eCompasses for consumer applications.

The 3-Axis accelerometer uses the TSV process of ST in order to remove the area reserved for I/O pads. The magnetometer dies use the latest process of Honeywell.

The LSM330D is targeted for consumer applications: Tilt compensated compass, Map rotation, Position detection It provides accurate output across full-scale ranges up to ±16g (linear acceleration) and ±12 Gauss (magnetic field).

This report provides complete tear-down of the 6-Axis electronic compass with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

Company Profiles

Physical Analysis
- Package X-Ray
- Package Opening
- Package Cross-Section
- ASIC Dimensions
- ASIC Delayering
- ASIC Cross-Section
- MEMS Accelerometer Dimensions
- MEMS Accelerometer Cap Opening
- MEMS Accelerometer Sensing Area
- MEMS Accelerometer Cross-section
- X/Y-Axis Magnetometer Dimensions
- X/Y-Axis Magnetometer Delayering
- X/Y-Axis Magnetometer Cross-section
- Z-Axis Magnetometer Dimensions
- Z-Axis Magnetometer Delayering
- Z-Axis Magnetometer Cross-section

Manufacturing Process Flow
- Front-End Manufacturing Process Flows
- Description of the Wafers Fabrication Units
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit

Cost Analysis
- Yields Hypotheses
- ASIC Wafer Cost
- ASIC Die Cost
- MEMS Accelerometer Wafer Cost
- MEMS Accelerometer Die Cost
- X/Y-Axis Magnetometer Wafer Cost
- X/Y-Axis Magnetometer Die Cost
- Z-Axis Magnetometer Wafer Cost
- Z-Axis Magnetometer Die Cost
- Back-End: Packaging Cost
- Back-End: Final test & Calibration Cost
- LSM303D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
- Manufacturer Financial Ratios
- LSM303D Estimated Selling Price

For more information visit  http://www.researchandmarkets.com/research/sl83ms/stmicroelectronics

Research and Markets
Laura Wood, Senior Manager
Email Contact
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks

SOURCE Research and Markets

Contact:
Research and Markets

Featured Video
Jobs
Senior Firmware Architect - Server Manageability for Nvidia at Santa Clara, California
GPU Design Verification Engineer for AMD at Santa Clara, California
Senior Platform Software Engineer, AI Server - GPU for Nvidia at Santa Clara, California
CAD Engineer for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Upcoming Events
Phil Kaufman Award Ceremony and Banquet to be held November 6 at Hayes Mansion at Hayes Mansion 200 Edenvale Ave San Jose CA - Nov 6, 2024
SEMICON Europa 2024 at Messe München München Germany - Nov 12 - 15, 2024
DVCon Europe 2023 at Holiday Inn Munich – City Centre Munich Germany - Nov 14 - 15, 2024
SEMI MEMS & Imaging Sensors Summit, at International Conference Center Munich Germany - Nov 14, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise