SANTA CLARA, Calif. — (BUSINESS WIRE) — January 29, 2013 — Rambus Inc. (NASDAQ: RMBS)
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Who: |
Rambus Inc. (NASDAQ: RMBS) |
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Where: |
DesignCon 2013 |
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| Santa Clara Convention Center – Booth #301 | |||
| Santa Clara, CA | |||
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When: |
January 28 – 31, 2013 |
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At DesignCon 2013, Rambus will unveil the innovative R+ enhanced industry standards platform. R+ offers the commercial benefits of industry-standard memory and chip-to-chip interfaces while enabling customers to differentiate products through specialized solutions. Additionally, Rambus will showcase innovations in 3D IC interposer technology. Rambus will be at booth #301, at the Santa Clara Convention Center in Santa Clara, CA.
Engineers from Rambus will also be presenting six technical papers on topics including: mixed signal designs, 3D interposers, memory controllers and 3D DRAM, high speed coded differential signaling, high-speed parallel buses and more. (see
RAMBUS TO PRESENT SIX PAPERS AT DESIGNCON 2013).
Rambus Demonstrations:
Extending Main Memory Beyond DDR4 – An R+ Technology
The demonstration showcases technologies that can extend main memory
beyond DDR4. With data rates of up to 6.4Gbps in a multi-rank,
multi-DIMM system, this high-performance, high-capacity technology
simplifies the system design and significantly reduces the overall
system power requirements.
