3D-IC, new device architectures, next-generation lithography, advanced materials and 450 mm are among the technical topic highlights to be featured next month at SEMICON Europa 2011, October 11-13, 2011 at Messe Dresden in Dresden, Germany.
SEMICON Europa remains the largest industry event in Europe focused on technologies and solutions for advanced microelectronics manufacturing including semiconductors, MEMS, printed and plastic electronics, power electronics and other emerging and related electronics markets. The technical agenda features papers and presentations from representatives of every major device maker and fab in Europe, as well as from leading European R&D organizations.
"SEMICON Europa is the heart and soul of the microelectronics industry in Europe," said Heinz Kundert, President of SEMI Europe. "It is the place where the entire industry gathers--suppliers, technologists, executives, and buying teams--to learn, network, and understand the technology developments and trends that shape and drive microelectronics innovation."
The TechARENA presentation stage this year will showcase more than 60 presentations covering the manufacturing supply chain from advanced materials to contemporary packaging, next-generation lithography, 3D-IC, metrology, automation and test. Additional sessions will also address technology and market issues in MEMS/MST and secondary equipment. TechARENA presenters include technologists and executives from every major device maker and fab in Europe including Altis, Analog Devices, Bosch, Colybris, CSR, Freescale, GLOBALFOUNDRIES, Infineon, Intel, IBM, Lfoundry, Micron, Nanium, Nokia, Numonyx, NXP, Osram, STMicroelectronics, Texas Instruments, Thales and X-Fab.
The SEMICON Europa 2011 technical program agenda includes more co-located events than ever before, including the 13th European Manufacturing Test Conference, the Advanced Packaging Conference, and the International MEMS/MST Industry Forum. Additionally, SEMICON Europa will again co-locate with the Plastics Electronics Conference and Exhibition (PE2011), which showcases emerging and growing technologies including OLEDs, organic sensors, bioelectronics, flexible electronics, displays, lighting and photovoltaics.
SEMICON Europa will also host the 15th European Fab Manager's Forum, a comprehensive half-day event covering issues and topics focused on improving manufacturing productivity and extending the life of existing fabs through new technologies and markets. Sessions include presentations on market dynamics, clustering, power semiconductors and advanced 200/300 mm production. Keynote presenters include Michael Campbell, Senior Vice President of Engineering, Qualcomm; and Martin Hierholzer, Vice President and General Manager, Infineon.
For the complete SEMICON Europa technical program agenda, including keynote presentations, sessions and short courses, and to register for the exposition, visit http://www.semiconeuropa.org/ .
