Boundary scan testing offers a solution to the challenges presented by high component density, the increasing use of area array packages – such as ball grid arrays (BGAs) and Field Programmable Gate Arrays (FPGAs) – and the prevalence of complex, multi-layer PCBs, which make test probe access and bed of nails testing impossible for many new board designs. The XJTAG Development System aims to solve these challenges and also allows test programs to be re-used and optimised for production testing.
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