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Title : Heat-Sink Solution through Artificial Nanodielectrics for LED Lighting Application
Company : Comsol
Date : 31-Mar-2013
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Featured Paper by N. Badi & R. Mekala

Thermally conducting but electrically insulating materials are needed for heat-sink LED lighting applications. We report on a cost effective and innovative method based on creating core-shell nanoparticles in polymer with aluminum (Al) nanoparticles as the high thermal conductivity core and ultrathin aluminum oxide (Al₂O₃) as a capping shell. The solid oxide shell around the Al core prevents agglomeration of Al nanoparticles. A coupled COMSOL heat transfer and AC/DC modules were used in the simulation. The mean effective thermal conductivity seems to exceed the value of 100W/m·K with an electrical permittivity of 52 at 12% Al-Al₂O₃ core-shell nanoparticles loading in a polyvinylidene fluoride polymer nanocomposite. These results are considered outstating but they need to be validated experimentally.
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