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 | Siemens EDA by Lee Wang Chip-level thermal analysis solves a main barrier to 3DICs |
 | Bridging the Frontier by Bob Smith, Executive Director And the 2024 Phil Kaufman Award Recipient is … Dr. Jason Cong |
 | Industry Predictions by Sanjay Gangal Rambus Introduces DDR5 Client Clock Driver, Paving the Way for High-Performance Laptops and Desktops |
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Featured Video
Editorial
|
| EDACafe Editorial by Roberto Frazzoli 40 Gbps UCIe IP; 300-mm GaN wafers; new edge AI SoCs; new US export controls |
More Editorial
Latest Blog Posts
|
| Siemens EDA by Lee Wang Chip-level thermal analysis solves a main barrier to 3DICs |
|
| Bridging the Frontier by Bob Smith, Executive Director And the 2024 Phil Kaufman Award Recipient is … Dr. Jason Cong |
|
| Industry Predictions by Sanjay Gangal Rambus Introduces DDR5 Client Clock Driver, Paving the Way for High-Performance Laptops and Desktops |
|
| EDACafe Editorial by Sanjay Gangal Accelerating AI-Driven Cloud Optimization: Inside Arm’s Partnership with Exostellar |
|
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