SMIC Reports 2009 Second Quarter Results
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SMIC Reports 2009 Second Quarter Results

All currency figures stated in this report are in US Dollars unless stated otherwise. The financial statement amounts in this report are determined in accordance with US GAAP.

SHANGHAI, July 28 /PRNewswire-Asia/ -- Semiconductor Manufacturing International Corporation (NYSE: SMI) ("SMIC" or the "Company"), one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended June 30, 2009.

    (Logo:  
www.newscom.com/cgi-bin/prnh/20090727/SMICLOGO )

    Second Quarter 2009 Highlights:

    -- Revenue up by 82.5% to $267.4 million from $146.5 million in 1Q09 and
       down by 22.0% compared to 2Q08.  Specifically, advanced logic sales
       from 0.13 micron and 90 nanometer nodes have significantly increased by
       135.3% quarter-over-quarter in the second quarter of 2009.
    -- Gross margins improved to -4.8% in 2Q09 compared to -88.3% in 1Q09 due
       to a significant increase in wafer shipments and fab utilization.
    -- Loss attributable to holders of ordinary shares of $98.1 million in
       2Q09, compared to a loss of $178.3 million in 1Q09.
    -- Fully diluted EPS was ($0.2196) per ADS.

    Third Quarter 2009 Guidance:

The following statements are forward looking statements which are based on current expectation and which involve risks and uncertainties, some of which are set forth under "Safe Harbor Statements" below.

    -- Revenue is expected to increase 14% to 18% QoQ.
    -- Operating expenses excluding foreign exchange difference are expected
       to range from $90 million to $93 million.
    -- Capital expenditures expected to range from $60 million to $65 million.
    -- Depreciation and amortization expected to be around $199 million to
       $201 million.

Commenting on the quarterly results, Dr. Richard Chang, Chief Executive Officer of SMIC, remarked, "In the second quarter of 2009, we witnessed strong business recovery on all fronts. Total revenue increased 82.5% quarter-over-quarter, exceeding our originally stated guidance. Our utilization rate increased to 75% in the second quarter as our logic shipments increased by 102% quarter-over-quarter. Advanced logic revenue for 0.13-micron and below grew by more than 135% from the first quarter of 2009, increasing to 41% as a portion of total revenue from 32% in the first quarter. This significant recovery was driven largely by our customers' strong performances in the communications and consumer segments. Our book-to-bill ratio has been greater than one in the past five consecutive months and new tape outs in the second quarter reached a record high for the last six quarters and are up 58.5% from the first quarter of 2009, preliminarily indicating a sustained recovery.

"Second quarter recovery was fueled by recovered customer demand across all regions and robust end demand in Asian markets. Regionally, our Greater China revenue in the second quarter increased by 87.4%, and North America revenue increased by 85.3% quarter-over-quarter. We also saw a healthy increase in our Europe sales this quarter.

"In terms of advanced technology development, we have already commenced risk production on our 65nm low-power process in the beginning of the third quarter. In addition, our 45nm low-power technology qualification process is on schedule with products from multiple customers under development, and we plan to pass full-scale technology qualification by the fourth quarter of 2009. Moreover, we have achieved successful completion of our first 45nm high performance GP yield lot, enabling us to further serve our customers with competitive advanced technology. Moving forward, we are confident that our continual efforts to strengthen our technology and overall product mix will lead us to a better position for profitability.

"We have maintained a positive EBITDA margin throughout this global economic cyclical downturn. We have also continued to exercise tight control over capital expenditures and enhance our financial position. For the six-month period ended June 30, 2009, we have spent in total $44.9 million on capital expenditures while for the same period, we have generated $121.3 million net cash from operations. Our $190 million annual capital expenditure budget is unchanged. With tight discipline over capital expenditures, we forecast that total depreciation and amortization expense will decline around 13% year-on-year in 2010.

"As our customer orders remain strong, we see current momentum for recovery to continue in the third quarter with double-digit revenue growth over the second quarter of 2009. We remain vigilant on our cost controls and continue to focus on enhancing our product portfolio, and commit to strengthening our operational and financial performances on all fronts as we strive toward our goal of achieving profitability."

    Conference Call / Webcast Announcement

    Date: July 29, 2009
    Time: 8:00 a.m. Shanghai time
    Dial-in numbers and pass code:
     U.S. 1-617-614-3672 / 1-800-260-8140 or HK 852-3002-1672
     (Pass code: SMIC).

A live webcast of the 2009 second quarter announcement will be available at http://www.smics.com under the "Investor Relations" section. An archived version of the webcast, along with an electronic copy of this news release will be available on the SMIC website for a period of 12 months following the webcast.

About SMIC

Semiconductor Manufacturing International Corporation (NYSE: SMI) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35um to 45nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction in Shenzhen, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.

    For more information, please visit http://www.smics.com

    Safe Harbor Statements

    (Under the Private Securities Litigation Reform Act of 1995)

This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements concerning whether a sustained recovery in the economy has begun, SMIC's plan to pass full-scale technology qualification for our 45nm low-power process by the fourth quarter of 2009, SMIC's ability to strengthen our technology and overall product mix, SMIC's expectations regarding the amount of its capital expenditures in 2009, SMIC's forecasted decline in total depreciation and amortization expense year-on-year in 2010, current momentum for continued recovery in the third quarter with double-digit revenue growth, and statements under "Depreciation and Amortization", "Capex Summary" and "Third Quarter 2009 Guidance", are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project" and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC's senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, the downturn in the global economy and the impact on China's economy, intense competition, timely wafer acceptance by SMIC's customers, timely introduction of new technologies, SMIC's ability to strengthen its technology and overall product mix, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, orders or judgments from pending litigation, availability of manufacturing capacity and financial stability in end markets.

Investors should consider the information contained in SMIC's filings with the U.S. Securities and Exchange Commission (SEC), including its annual report on 20-F, filed with the SEC on June 22, 2009, especially in the "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" sections, and such other documents that SMIC may file with the SEC or SEHK from time to time, including on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC's future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release. Except as required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.

    Material Litigation

    Recent TSMC Legal Developments:

On August 25, 2006, TSMC filed a lawsuit against the Company and certain subsidiaries, namely SMIC (Shanghai), SMIC (Beijing) and SMIC (Americas) in the Superior Court of the State of California, County of Alameda for alleged breach of a settlement agreement, alleged breach of promissory notes and alleged trade secret misappropriation by the Company. TSMC seeks, among other things, damages, injunctive relief, attorneys' fees, and the acceleration of the remaining payments outstanding under that settlement agreement.

In the present litigation, TSMC alleges that the Company has incorporated TSMC trade secrets in the manufacture of the Company's 0.13 micron or smaller process products. TSMC further alleges that as a result of this claimed breach, TSMC's patent license is terminated and the covenant not to sue is no longer in effect with respect to the Company's larger process products. The Company has vigorously denied all allegations of misappropriation. The Court has made no finding that TSMC's claims are valid. The Court has set a trial date of September 8, 2009.

On September 13, 2006, the Company announced that in addition to filing a response strongly denying the allegations of TSMC in the United States lawsuit, it filed on September 12, 2006, a cross-complaint against TSMC seeking, among other things, damages for TSMC's breach of contract and breach of implied covenant of good faith and fair dealing.

On November 16, 2006, the High Court in Beijing, the People's Republic of China, accepted the filing of a complaint by the Company and its wholly-owned subsidiaries, namely, SMIC (Shanghai) and SMIC (Beijing), regarding the unfair competition arising from the breach of bona fide (i.e. integrity, good faith) principle and commercial defamation by TSMC ("PRC Complaint"). In the PRC Complaint, the Company is seeking, among other things, an injunction to stop TSMC's infringing acts, public apology from TSMC to the Company and compensation from TSMC to the Company, including profits gained by TSMC from their infringing acts.

On August 14, 2007, the Company filed an amended cross-complaint against TSMC seeking, among other things, damages for TSMC's breach of contract and breach of patent license agreement. TSMC thereafter denied the allegations of the Company's amended cross-complaint and subsequently filed additional claims that the Company breached a settlement agreement by filing an action in the Beijing High Court. The Company has denied these additional claims by TSMC.

On August 15-17, 2007, the California Court held a preliminary injunction hearing on TSMC's motion to enjoin use of certain process recipes in certain of the Company's 0.13 micron logic process flows.

On September 7, 2007, the Court denied TSMC's preliminary injunction motion, thereby leaving unaffected the Company's development and sales. However, the court required the Company to provide 10 days' advance notice to TSMC if the Company plans to disclose logic technology to non-SMIC entities under certain circumstances, to allow TSMC to object to the planned disclosure.

In May 2008, TSMC filed a motion in the California Court for summary adjudication against the Company on several of the Company's cross claims. The Company opposed the motion and on August 6, 2008, the Court granted in part and denied in part TSMC's motion.

On June 23, 2008, the Company filed in the California court a cross-complaint against TSMC seeking, among other things, damages for TSMC's unlawful misappropriation of trade secrets from SMIC to improve its competitive position against SMIC.

On July 10, 2008, the California Court held a preliminary injunction hearing on TSMC's motion to enjoin disclosure of information on certain process recipes in the Company's 0.30 micron logic process flows to 3rd parties. On August 8, 2008, the Court granted-in-part TSMC's motion and preliminarily enjoined SMIC from disclosing fourteen 0.30 micron process steps. On October 3, 2008, SMIC filed a notice of appeal of the Court's August 8, 2008 Order with the California Court of Appeal. This appeal is currently pending.

During the pre-trial proceedings in the matter, as noted above under "Overview of TSMC Litigation", questions arose regarding the actual terms of the 2005 Settlement Agreement between SMIC and TSMC. Accordingly, the California Court held a preliminary trial on January 13 to 16, 2009, limited to a determination of the terms of the Settlement Agreement and an interpretation of any requirements to "meet and confer" prior to institution of litigation. On March 10, 2009, the Court issued a Statement of Decision finding, in part, that an agreement between the parties was executed on January 30, 2005, and thereafter amended on February 2, 2005, as urged by TSMC. The Company believes the Court's ruling is erroneous. The ruling may be appealed by SMIC following the filing of a final judgment by the Court in this matter.

On May 1, 2009, the Company filed motions for summary adjudication against TSMC's claims for breach of promissory notes and violation of the California Uniform Trade Secrets Act. The motions were heard by the Court on July 17, 2009. On July 20, 2009, the Court denied the Company's motions.

The California Court has further scheduled a trial upon all liability issues related to a selected list of TSMC trade secret claims and SMIC trade secret claims to commence on September 8, 2009.

In the Company's action in the Beijing High People's Court, following an unsuccessful challenge to that Court's jurisdiction by TSMC, the Court has held evidentiary hearings on October 15, October 29, and November 25, 2008. The Court rendered its first-instance judgment on June 10, 2009. Claims of SMIC against TSMC were not supported by the Court in the first-instance judgment. SMIC has appealed the first-instance judgment to the PRC Supreme People's Court.

Under the provisions of SFAS 144, the Company is required to make a determination as to whether or not this pending litigation represents an event that requires a further analysis of whether the patent license portfolio has been impaired. We believe that the lawsuit is at a discovery stage and we are still evaluating whether or not the litigation represents such an event. The Company expects further information to become available to us, which will aid us in making a determination. The outcome of any impairment analysis performed under SFAS 144 might result in a material impact to our financial position and results of operations. Because the case is in its discovery stage, the Company is unable to evaluate the likelihood of an unfavourable outcome or to estimate the amount or range of potential loss.



              Summary of Second Quarter 2009 Operating Results

         Amounts in US$ thousands, except for EPS and operating data

                                  2Q09      1Q09     QoQ     2Q08       YoY
    Revenue                    267,422   146,519    82.5%  342,919    -22.0%
    Cost of sales              280,319   275,900     1.6%  322,077    -13.0%
    Gross profit (loss)        (12,897) (129,381)  -90.0%   20,842        --
    Operating expenses          81,606    46,681    74.8%   60,750     34.3%
    Loss from operations       (94,503) (176,062)  -46.3%  (39,908)   136.8%
    Other expenses, net         (5,802)   (4,480)   29.5%   (5,193)    11.7%
    Income tax (expenses)
     credit                      2,880     3,305   -12.8%   (2,046)       --
    Net loss after income
     taxes                     (97,425) (177,238)  -45.0%  (47,147)   106.6%
    Loss from equity
     investment                   (482)     (874)  -44.9%      (85)   467.1%

    Net loss                   (97,907) (178,111)  -45.0%  (47,232)   107.3%

    Accretion of interest to
     non-controlling interest
     holder                       (262)     (259)    1.1%    1,603        --

    Loss attributable to
     holders of
     ordinary shares           (98,169) (178,370)  -45.0%  (45,629)   115.1%

    Gross margin                 -4.8%    -88.3%              6.1%
    Operating margin            -35.3%   -120.2%            -11.6%

    Net loss per ordinary
     share (basic)(1)            (0.00)    (0.01)            (0.00)
    Net loss per ADS (basic)     (0.22)    (0.40)            (0.12)
    Net loss per ordinary
     share (diluted)(1)          (0.00)    (0.01)            (0.00)
    Net loss per ADS
     (diluted)                   (0.22)    (0.40)            (0.12)

    Wafers shipped (in 8"
     wafers)(2)                341,261   168,682   102.3%  402,114    -15.1%

    Capacity utilization         75.4%     34.9%             92.2%

    Note:
    (1) Based on weighted average ordinary shares of 22,352 million (basic)
        and 22,352 million (diluted) in 2Q09, 22,344 million (basic) and
        22,344 million (diluted) in 1Q09 and 18,589 million (basic) and
        18,589 million (diluted) in 2Q08
    (2) Including copper interconnects


    -- Revenue increased to $267.4 million in 2Q09, up 82.5% QoQ from $146.5
       million in 1Q09 due to a 102.3% increase in wafer shipments.
    -- Cost of sales increased to $280.3 million in 2Q09, up 1.6% QoQ from
       $275.9 million in 1Q09.
    -- Gross loss reduced to $12.9 million in 2Q09, compared to a gross loss
       of $129.4 million in 1Q09 and gross profit of $20.8 million in 2Q08.
    -- Gross margins improved to -4.8% in 2Q09 from -88.3% in 1Q09 primarily
       due to a significant increase in wafer shipments and fab utilization
       QoQ.
    -- Total operating expenses increased to $81.6 million from $46.7 million,
       an increase of 74.8% QoQ.
    -- R&D expenses increased to $48.5 million in 2Q09, up 162.0% QoQ from
       $18.5 million since no substantial government subsidies were received
       in 2Q09.  Excluding the government subsidies, R&D expenses increased by
       $7.4 million, representing an 18.0% increase QoQ due to higher expenses
       related to 45nm and other R&D activities.
    -- G&A expenses increased to $17.2 million in 2Q09 from $14.9 million in
       1Q09 due to a foreign exchange gain of $5.9 million associated with
       operating activities recorded in 1Q09.  Excluding the foreign exchange
       difference, G&A expenses were reduced by $4.7 million, representing a
       22.5% decrease QoQ.
    -- Selling & marketing expenses increased to $6.9 million in 2Q09, up
       64.1% QoQ from $4.2 million in 1Q09 due to an increase in selling
       expenses.



    Analysis of Revenues

    Sales Analysis
    By Application                                   2Q09     1Q09    2Q08
    Computer                                         4.3%     4.2%    7.9%
    Communications                                  53.5%    50.9%   51.1%
    Consumer                                        36.1%    32.9%   32.4%
    Others                                           6.1%    12.0%    8.6%

    By Service Type                                  2Q09     1Q09    2Q08
    Logic(1)                                        90.9%    85.3%   85.7%
    DRAM                                             2.7%     2.8%    3.6%
    Mask Making, testing, others                     6.4%    11.9%   10.7%

    By Customer Type                                 2Q09     1Q09    2Q08
    Fabless semiconductor companies                 65.1%    70.9%   54.6%
    Integrated device manufacturers (IDM)           18.2%    11.4%   25.7%
    System companies and others                     16.7%    17.7%   19.7%

    By Geography                                     2Q09     1Q09    2Q08
    North America                                   61.4%    60.4%   55.1%
    Greater China(2)                                33.2%    32.3%   31.4%
    Asia Pacific(3)                                  3.9%     5.2%    6.9%
    Europe                                           1.5%     2.1%    6.6%
    Wafer Revenue Analysis

    By Technology (logic, DRAM & copper              2Q09     1Q09    2Q08
     interconnect only)
    0.065um                                          0.1%     0.1%    0.0%
    0.09um                                          16.6%     8.1%   18.4%
    0.13um                                          29.7%    30.8%   22.9%
    0.15um                                           1.5%     0.8%    2.1%
    0.18um                                          29.8%    31.5%   37.7%
    0.25um                                           0.5%     0.4%    0.6%
    0.35um                                          21.8%    28.3%   18.3%

    Note:
    (1) Including 0.13um copper interconnects
    (2) Including Hong and Taiwan
    (3) Excluding Greater China



    Capacity*

    Fab / (Wafer Size)                                       2Q09       1Q09
    Shanghai Mega Fab (8")                                 88,000     85,000
    Beijing Mega Fab (12")                                 40,500     33,750
    Tianjin Fab (8")                                       34,300     32,000
    Total monthly wafer fabrication capacity              162,800    150,750

    Note:
    * Wafers per month at the end of the period in 8" wafers

    -- The increase in fab capacity during the quarter resulted from an
       improvement in overall fab production efficiency.



    Shipment and Utilization

    8" equivalent wafers                       2Q09         1Q09        2Q08
    Wafer shipments including
     copper interconnects                   341,261      168,682     402,114

    Utilization rate(1)                       75.4%        34.9%       92.2%

    Note:
    (1) Capacity utilization based on total wafer out divided by estimated
        capacity

    -- Wafer shipments increased 102.3% QoQ to 341,261 units of 8-inch
       equivalent wafers in 2Q09 from 168,682 units of 8-inch equivalent
       wafers in 1Q09, and down 15.1% YoY from 402,114 8-inch equivalent
       wafers in 2Q08.



    Detailed Financial Analysis

    Gross Profit Analysis

    Amounts in US$ thousands      2Q09      1Q09        QoQ     2Q08      YoY
    Cost of sales              280,319   275,900       1.6%  322,077   -13.0%
      Depreciation             146,763   158,000      -7.1%  153,783    -4.6%
      Other manufacturing
       costs                   126,655   111,166      13.9%  160,938   -21.3%
      Deferred cost
       amortization              5,886     5,886       0.0%    5,886     0.0%
      Share-based compensation   1,015       848      19.7%    1,470   -31.0%
    Gross profit (loss)        (12,896) (129,381)    -90.0%   20,842       --
    Gross margin                 -4.8%    -88.3%                6.1%

    -- Cost of sales increased to $280.3 million in 2Q09, up 1.6% QoQ from
       $275.9 million in 1Q09.
    -- Gross loss reduced to $12.9 million in 2Q09, compared to a gross loss
       of $129.4 million in 1Q09 and gross profit of $20.8 million in 2Q08.
    -- Gross margins improved to -4.8% in 2Q09 from -88.3% in 1Q09 primarily
       due to an increase in wafer shipments and fab utilization QoQ.



    Operating Expense Analysis

    Amounts in US$ thousands           2Q09    1Q09     QoQ    2Q08      YoY
    Total operating expenses         81,606  46,681   74.8%  60,750    34.3%
      Research and development       48,450  18,494  162.0%  37,684    28.6%
      General and administrative     17,196  14,928   15.2%  13,328    29.0%
      Selling and marketing           6,905   4,208   64.1%   4,356    58.5%
      Amortization of intangible
       assets                         8,858   9,031   -1.9%   6,898    28.4%
      Loss (income) from disposal
       of properties                    197      20  861.7%  (1,517)      --

    -- Total operating expenses increased to $81.6 million in 2Q09 from $46.7
       million, an increase of 74.8% QoQ.
    -- R&D expenses increased to $48.5 million in 2Q09, up 162.0% QoQ from
       $18.5 million since no substantial government subsidies were received
       in 2Q09.  Excluding the government subsidies, R&D expenses increased by
       $7.4 million, representing an 18.0% increase QoQ due to higher expenses
       related to 45nm and other R&D activities.
    -- G&A expenses increased to $17.2 million in 2Q09 from $14.9 million in
       1Q09 due to a foreign exchange gain of $5.9 million associated with
       operating activities recorded in 1Q09.  Excluding the effect from the
       foreign exchange difference, G&A expenses were reduced by $4.7 million,
       representing a 22.5% decrease QoQ.
    -- Selling & marketing expenses increased to $6.9 million in 2Q09, up
       64.1% QoQ from $4.2 million in 1Q09 due to an increase in selling
       expenses.



    Other Income (Expenses)

    Amounts in US$ thousands          2Q09    1Q09      QoQ    2Q08      YoY
    Other income (expenses)         (5,802) (4,480)   29.5%  (5,193)   11.7%
      Interest income                  635     436    45.5%   4,059   -84.4%
      Interest expense              (8,386) (5,498)   52.5% (15,279)  -45.1%
      Foreign currency exchange
       gain (loss)                     219    (357)      --   2,478   -91.2%
      Other, net                     1,730     939    84.2%   3,549   -51.3%

    -- Overall interest expense increased in 2Q09 due to lower interest
       subsidies received from local governments during the quarter.
    -- Combined with the foreign exchange difference arising from operating
       activities, the Company recorded an overall foreign exchange loss of
       $0.8 million in 2Q09 as compared to a foreign exchange gain of $5.5
       million in 1Q09.


    Depreciation and Amortization

    -- Total depreciation and amortization in 2Q09 was $202.9 million compared
       to $207.8 million in 1Q09.



    Liquidity

    Amounts in US$ thousands                              2Q09          1Q09
    Cash and cash equivalents                          435,613       502,016
    Restricted cash                                     22,580        11,228
    Short term investments                               3,313        20,732
    Accounts receivable                                236,413       156,177
    Inventory                                          183,012       154,783
    Others                                              74,717        78,728
    Total current assets                               955,648       923,664

    Accounts payable                                   166,699       135,352
    Short-term borrowings                              273,678       270,078
    Current portion of long-term debt                  205,344       359,080
    Others                                             147,726       144,146
    Total current liabilities                          793,447       908,656

    Cash Ratio                                            0.5x          0.5x
    Quick Ratio                                           0.8x          0.7x
    Current Ratio                                         1.2x          1.0x



    Capital Structure

    Amounts in US$ thousands                            2Q09            1Q09
    Cash and cash equivalents                        435,613         502,016
    Restricted cash                                   22,580          11,228
    Short-term investment                              3,313          20,732

    Current portion of promissory note                29,242          29,493
    Promissory note                                    9,500          23,792

    Short-term borrowings                            273,678         270,078
    Current portion of long-term debt                205,344         359,080
    Long-term debt                                   615,999         533,090
    Total debt                                     1,095,021       1,162,248

    Shareholders' equity                           2,478,322       2,573,891

    Total debt to equity ratio                         44.2%           45.2%

    -- With the strong support from our relationship banks, we have
       successfully refinanced the remaining $300 million long-term loan for
       our Beijing subsidiary during the quarter and extended the loan
       maturity by two and a half years.



    Cash Flow

    Amounts in US$ thousands                              2Q09          1Q09
    Net cash from operating activities                  43,198        78,117
    Net cash from investing activities                 (27,353)      (81,785)
    Net cash from financing activities                 (82,191)       54,846

    Net change in cash                                 (66,403)       51,786


    Capex Summary

    -- Capital expenditures for 2Q09 were $21 million.  For the six-month
       period ended on June 30, 2009, the total capital expenditure was $44.9
       million.
    -- Total planned capital expenditures for 2009 will be approximately $190
       million and will be adjusted based on market conditions.


    Recent Highlights and Announcements

    -- SMIC Achieves Silicon Success with High Performance 45-nanometer
       Process [2009-06-30]
    -- SMIC Revises Up Second Quarter 2009 Quarter-on-Quarter Revenue Guidance
       [2009-06-29]
    -- SMIC and Synopsys Announce the Availability of Reference Flow 4.0
       [2009-06-24]
    -- Change in Directorate and Change of Chairman [2009-06-23]
    -- Annual General Meeting Held on June 23rd, 2009 Poll Results [2009-06-23]
    -- Annual Report Pursuant to Section 13 or 15(d) of the Securities
       Exchange Act of 1934 [2009-06-22]
    -- SMIC Deploys Synopsys HSPICE Simulator for 45-nm Physical IP and
       Standard Cell Development [2009-06-4]
    -- Closure of Register of Members [2009-06-03]
    -- SMIC Announces Availability of 65-nanometer Low Leakage Process IP
       Portfolio [2009-05-15]
    -- Grant of Options [2009-05-11]
    -- SMIC Reports Results for the Three Months Ended March 31, 2009
       [2009-04-29]
    -- Notice of Annual General Meeting [2009-04-27]
    -- 2008 Annual Report [2009-04-27]
    -- SMIC Circular [2009-04-27]
    -- Non-exempt Continuing Connected Transactions With Datang [2009-04-17]
    -- Announcements of 2008 Annual Results [2009-04-17]
    -- SMIC and Dolphin Integration announce strategic partnership for
       Portable Media Players [2009-04-17]
    -- Notification of Board Meeting [2009-04-16]
    -- Notification of Approval of the Publication of 2008 Annual Results by
       the Board [2009-04-03]

Please visit SMIC's website at http://www.smics.com/website/enVersion/Press_Center/pressRelease.jsp for further details regarding the recent announcements.



              Semiconductor Manufacturing International Corporation
                          CONSOLIDATED BALANCE SHEET
                                (In US dollars)

                                                      As of the end of
                                                June 30, 2009  March 31, 2009
                                                 (Unaudited)    (Unaudited)
    ASSETS
    Current assets:
      Cash and cash equivalents                  435,613,297     502,015,857
      Restricted Cash                             22,579,630      11,227,741
      Short-term investments                       3,312,592      20,731,562
      Accounts receivable, net of allowances
       of $5,637,336 and $5,870,986 at June 30
       and March 31, 2009, respectively          236,412,588     156,177,160
      Inventories                                183,011,768     154,783,494
      Prepaid expense and other current assets    53,276,615      57,287,558
      Receivable for sale of manufacturing
       equipment                                  21,440,494      21,440,494
    Total current assets                         955,646,984     923,663,866

    Prepaid land use rights                       78,860,359      79,234,650
    Plant and equipment, net                   2,625,371,271   2,792,875,058
    Acquired intangible assets, net              184,845,479     191,028,492
    Deferred cost, net                            35,318,637      41,205,077
    Equity investment                             10,275,172      10,756,777
    Other long-term prepayments                      825,389       1,486,807
    Deferred tax assets                           57,250,700      51,969,380
    TOTAL ASSETS                               3,948,393,991   4,092,220,107

    LIABILITIES AND STOCKHOLDERS' EQUITY
    Current liabilities:
      Accounts payable                           166,698,508     135,351,888
      Accrued expenses and other current
       liabilities                               117,632,973     114,185,387
      Short-term borrowings                      273,678,075     270,078,251
      Current portion of promissory note          29,242,001      29,492,873
      Current portion of long-term debt          205,343,559     359,079,883
      Income tax payable                             851,539         467,869
    Total current liabilities                    793,446,655     908,656,151

    Long-term liabilities:
      Promissory notes                             9,500,358      23,792,341
      Long-term debt                             615,998,747     533,090,173
      Long-term payables relating to
       license agreements                         16,488,420      18,375,736
      Deferred tax liabilities                       335,577         373,727
    Total long-term liabilities                  642,323,102     575,631,977

    Total liabilities                          1,435,769,757   1,484,288,128

     Non-Controlling interest                     34,302,529      34,040,748

    Commitments

    Stockholders' equity:
      Ordinary shares, $0.0004 par value,
       50,000,000,000 shares authorized, shares
       issued and outstanding 22,353,411,672
       and 22,350,521,609 at June 30 and
       March 31, 2009, respectively                8,941,365       8,940,209
      Additional paid-in capital               3,494,327,734   3,491,661,468
      Accumulated other comprehensive
      (loss) income                                   98,945         169,290
      Accumulated deficit                     (1,025,046,339)   (926,879,736)
    Total stockholders' equity                 2,478,321,705   2,573,891,231

    TOTAL LIABILITIES AND STOCKHOLDERS'
     EQUITY                                    3,948,393,991   4,092,220,107



             Semiconductor Manufacturing International Corporation
                     CONSOLIDATED STATEMENT OF OPERATIONS
                               (In US dollars)

                                                 For the three months ended
                                                June 30, 2009   March 31, 2009
                                                  (Unaudited)     (Unaudited)
    Sales                                         267,422,419    146,518,884
    Cost of sales                                 280,318,656    275,899,824
    Gross loss                                    (12,896,237)  (129,380,940)

    Operating expenses:
    Research and development                       48,450,248     18,494,784
    General and administrative                     17,195,574     14,927,735
    Selling and marketing                           6,904,892      4,207,593
    Amortization of acquired intangible assets      8,858,012      9,030,614
    Loss from sale of equipment and other
     fixed assets                                     196,980         20,484
    Total operating expenses, net                  81,605,706     46,681,210

    Loss from operations                          (94,501,943)  (176,062,150)

    Other income (expense):
    Interest income                                   634,737        436,294
    Interest expense                               (8,386,025)    (5,498,154)
    Foreign currency exchange gain (loss)             219,319       (357,034)
    Others, net                                     1,730,404        938,969
    Total other expense, net                       (5,801,565)    (4,479,925)

    Loss before income tax                       (100,303,508)  (180,542,075)

    Income tax benefit                              2,880,291      3,304,513
    Loss from equity investment                      (481,605)      (873,513)
    Net loss                                      (97,904,822)  (178,111,075)

    Accretion of interest to non-controlling
     interest holder                                 (261,781)      (258,904)

    Loss attributable to holders of ordinary
     shares                                       (98,166,603)  (178,369,979)

    Net loss per share, basic                         (0.0044)       (0.0080)
    Net loss per ADS, basic                           (0.2196)       (0.3992)
    Net loss per share, diluted                       (0.0044)       (0.0080)
    Net loss per ADS, diluted                         (0.2196)       (0.3992)

    Shares used in calculating basic
     loss per share                            22,352,477,317 22,343,640,476

    Shares used in calculating diluted loss
     per share                                 22,352,477,317 22,343,640,476



             Semiconductor Manufacturing International Corporation
                      CONSOLIDATED STATEMENT OF CASH FLOWS
                               (In US dollars)

                                                 For the three months ended
                                               June 30, 2009   March 31, 2009
                                                 (Unaudited)     (Unaudited)
    Operating activities:

    Net Loss                                    (97,904,822)    (178,111,075)

    Adjustments to reconcile net loss to net
     cash provided by operating activities:

    Deferred taxes                               (5,319,471)      (6,321,059)
    Loss from sale of equipment and other
     fixed assets                                   196,980           20,484
    Depreciation and amortization               191,368,626      196,535,950
    Non-cash interest expense on promissory
     note and long-term payable relating to
     license agreements                             992,974        1,046,426
    Amortization of acquired intangible assets    8,858,012        9,030,614
    Share-based compensation                      2,630,178        2,272,359
    Loss from equity investment                     481,605          873,513
    Changes in operating assets and liabilities:
    Accounts receivable, net                    (80,235,429)      43,194,535
    Inventories                                 (28,228,273)      16,853,373
    Prepaid expense and other current assets      4,672,361         (579,942)
    Accounts payable                             39,046,117       (6,456,221)
    Accrued expenses and other current
     liabilities                                  6,255,592         (158,281)
    Income tax payable                              383,671          (84,138)

    Net cash provided by operating
     activities                                  43,198,121       78,116,538

    Investing activities:

    Purchase of plant and equipment             (44,759,433)     (72,018,394)
    Proceeds from government grant to
     purchase plant and
    equipment                                    14,544,928        6,437,831
    Proceeds from sale of equipment                (191,827)       1,700,577
    Proceeds received from sale of assets
     held for sale                                  (26,201)         770,931
    Purchase of acquired intangible assets       (2,987,788)     (12,621,260)
    Purchase of short-term investments           (5,648,618)     (31,496,963)
    Sale of short-term investments               23,067,587       30,693,690
    Change in restricted cash                   (11,351,889)      (4,972,928)
    Purchase of equity investment                        --         (278,103)

    Net cash used in investing activities       (27,353,241)     (81,784,619)

    Financing activities:

    Proceeds from short-term borrowings         215,404,493      182,644,921
    Repayment of short-term borrowings         (211,804,669)    (113,824,443)
    Repayment of long-term debt                 (70,827,750)      (4,977,014)
    Repayment of promissory note                (15,000,000)              --
    Proceeds from exercise of employee stock
     options                                         37,245           15,937
    Redemption of non-controlling interest               --       (9,013,444)

    Net cash provided by (used in) financing
     activities                                 (82,190,681)      54,845,957

    Effect of exchange rate changes                 (56,759)         608,412

    NET (DECREASE) INCREASE IN CASH AND CASH
     EQUIVALENTS                                (66,402,560)      51,786,288

    CASH AND CASH EQUIVALENTS, beginning of
     period                                     502,015,857      450,229,569

    CASH AND CASH EQUIVALENTS, end of period    435,613,297      502,015,857


    For more information, please contact:

    Investor Contacts:

    En-Ling Feng
    Tel:   +86-21-3861-0000 x16275
    Email: Enling_Feng@smics.com

    Anne Wong Chen
    Tel:   +86-21-3861-0000 x12804
    Email: Anne_CAYW@smics.com

    Edith Kwan
    Tel:   +852-2116-2624
    Email: Edith_Kwan@smics.com

SOURCE Semiconductor Manufacturing International Corporation

Web site: http://www.smics.com//