Registration
Please refer to ISQED
web site at
www.isqed.org for information regarding the tutorials,
conference, tutorials, and hotel registration. Direct all conference
inquiries to isqed@isqed.org. Early
registration is recommended to take advantage of the discounted
registration fee.
Exhibitions
ISQED08 Exhibition
floor will be open on Tuesday afternoon, March 18, and features
vendors offering design tools, methodologies, and services in the
areas of design for manufacturing, yield, reliability, and quality.
Exhibition includes embedded tutorials, panel discussions, and over 50
technical presentations. Exhibition floor attendance is free but needs
advance on-line registration.
About
ISQED
The International
Symposium on Quality Electronic Design (ISQED) is a leading Electronic
Design & Design Automation conference, aimed at bridging the gap among
electronic design tools and processes, integrated circuit
technologies, processes & manufacturing, to achieve design quality.
ISQED is the pioneer and leading international conference dealing with
design for manufacturability and quality issues front-to-back. ISQED
emphasizes a holistic approach toward electronic design and intends to
highlight and accelerate cooperation among the IC Design, EDA,
Semiconductor Process Technology and Manufacturing communities. ISQED
spans three days, Monday through Wednesday, in three parallel tracks,
hosting over100 technical presentations, six keynote speakers, panel
discussions, workshops/tutorials and other informal meetings.
Conference Highlights
Tutorials/Workshops
ISQED 2008 is pleased
to offer a single full-day tutorial track, as well as three embedded
tutorials, presented by several experts in their respective fields.
List of topics covered is as follows:
The
promise of high-κ/metal gates – From electronic transport phenomena to
emerging device/circuit applications:
K. Maitra, AMD
Low
Voltage Circuit Design Techniques for Sub-32nm Technologies:
Chris Kim,
University of Minnesota
Process Technology Development and New Design Opportunities in 3D
Integration Technology:
Robert E. Jones,
Freescale
Robust System Design in Scaled CMOS:
Subhasis Mitra,
Stanford University
Caches in the Many-Core Era: What Purpose Might eDRAM Serve?:
Hillary Hunter,
IBM
Enhancing Yield through Design for Manufacturability (DFM):
Praveen
Elakkumanan, IBM / Puneet Gupta, UCLA
Managing early design feasibility issues through system physical
prototyping:
Matthew Raggett
- Javelin Design Automation
How
to Determine Best DFM Practices:
Tom Jackson,
Cadence
Mil/Aero/Vehicle High Reliability Design -
Issues/challenges/solutions:
Chris Nicklaw,
L3 Communications
Modifications and Tradeoffs in the Creation and Characterization of
High Reliability IP:
Jens C. Michelsen,
Nangate
Plenary Sessions
Two plenary sessions
will be held on Tuesday and Wednesday mornings. Several industry &
academia leaders will discuss the issues surrounding electronic
design, design for yield and manufacturability and other critical
topics from various points of view. Plenary keynote speakers are:
Drew Gude,
Microsoft
Corporation
Robert Hum,
Mentor
Graphics Corporation
Sanjiv Taneja,
Cadence
Design Systems
Chandu Visweswariah,
IBM Thomas
J. Watson Research Center
Rich Goldman,
Synopsys Inc.
Panel
Discussions
ISQED is pleased to
offer three high-power panel discussion sessions, where many leading
experts, address the important issue of quality design. These panels
would focus on the following topics:
1.
DFM: Is it Helping or Hurting?
2.
Statistical Design - Solutions Searching for Problems?
3.
ESL 2.0- Is Anybody Using It 2.0?
Luncheon Keynote
EDA Is Truly Where Electronics Quality Begins!
Antun Domic,
Synopsys
Technical Sessions
ISQED Technical
sessions start on Tuesday March 18, and continue until the afternoon
of Wednesday, March 19. Beside the above plenary sessions, panel
discussions, and workshops, the program consists of 22 technical
sessions featuring well over100 papers on various challenging topics
related to design for manufacturability and quality. A partial list of
topics is shown below. Detail program is available on the web at
www.isqed.org.
1. Manufacturing,
Semiconductor Process and Devices
1.1 Design for
Manufacturability/Yield & Quality (DFM/DFY/DFQ)
2. Design
2.1 System-level
Design, Methodologies & Tools (SDM)
2.2 Package - Design Interactions & Co-Design
(PDI)
2.3 Robust & Power-conscious Devices,
Interconnects, and Circuits (PCC)
2.4
Emerging/Innovative Process & Device Technologies and Design Issues
(EDT)
2.5
Design of Reliable Circuits and Systems (DFR)
3. EDA/CAD
3.1 EDA
Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse
(EDA)
3.2 Design Verification and Design for
Testability (DVFT)
3.3 Physical Design, Methodologies & Tools (PDM)
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