The IDT AMB+ meets the increasing memory storage requirements of servers and workstations that must achieve higher-performance to support the demands of e-commerce, web-hosting, enterprise and other mission-critical applications. The challenge for these computing platforms is to continue to scale memory performance and capacity, while reducing power consumption to fit within the tightening constraints of ever-growing data centers. The high-speed, serial, point-to-point connection between the memory controller and modules on the channel is a key attribute of the FB-DIMM channel architecture used in the memory subsystem of today's platforms. The DRAMs populated on the FB-DIMM rely on the IDT AMB+ to provide that functionality. The AMB+ located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip, and receives or forwards it to the next DIMM or memory controller.
Designed from the start in anticipation of the power concern surrounding data centers, the AMB+ reduces memory subsystem power consumption by up to forty percent, enabling increased compute capacity within existing infrastructure, while reducing operating expenditure. In addition to savings derived directly from low power consumption, the collateral reduction of thermal levels significantly reduces system cooling requirements, allowing deployment of low-noise cooling mechanisms in servers, which has not been practical until now.
"IDT was the first company to introduce the AMB, and with this third generation device we are the first to provide a much-needed, ultra low-power solution to address the pressing power challenges in the industry," said Sean Fan, vice president and general manager of the IDT Memory Interface Division. "With the AMB+, IDT continues to expand its industry leadership in memory interface technology and products by offering a quantum leap in power reduction, setting a new standard for server memory subsystems."
The IDT AMB+ is a drop-in, ready-to-use solution that immediately provides twenty-five percent savings over previous solutions, even while operating with DDR2-800 DRAMs. Additional power savings can be achieved by special provisioning incorporated in the device, such as an optional 1.5V core power supply, instead of traditional 1.8V. Consequently, a full-module heat-spreader may no longer be necessary, significantly reducing bill of material costs and increasing packing density.
Availability
Advanced engineering samples of the IDT AMB+ are currently available to qualified customers. General sampling and production are scheduled for Q3, 2007. For additional information, visit www.IDT.com.
About IDT
IDT is a world leader in developing and delivering vital semiconductor solutions that enable customers to accelerate innovation. IDT solutions help customers solve complex system design challenges associated with the evolving requirements of communications, computing and consumer applications. By leveraging its system knowledge and extensive blend of technologies, IDT is able to deliver essential solutions, including timing products, network search engines, flow-control management ICs and products for standards-based serial switching. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Market(R) under the symbol "IDTI." Additional information about IDT is accessible at www.IDT.com/go/amb.
IDT and the IDT logo is a registered trademark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners.
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