IMAPS Device Packaging Conference and Open House Gives Surfect Opportunity to Introduce Their Revolutionary Ascent 200mm Single Cell Wafer Bumping Interconnect Tool and Process

ALBUQUERQUE, N.M., March 27 /PRNewswire-FirstCall/ -- Surfect Technologies, Inc., a wholly-owned subsidiary of Surfect Holdings, Inc. (OTC Bulletin Board: SUFH), held an Open House as a tie in with the IMAPS event show in Scottsdale Arizona. The International Conference and Exhibition on Device Packaging was held from March 19-22nd and focused on leading technology for flip chip, chip scale packaging (CSP), MEMs, and Biomedical technology.

"Surfect participated directly in this symposium with a technical paper on the 'Development of a Single Chamber, Multi-Metal, Bump Plating Tool' presented by Lee Levine. Our booth in the show area gave us the opportunity to meet and discuss customers' plating process needs and planned developments. Our plating machine models Ascent-200 and Leapfrog-300 are well positioned to offer customers low cost of entry for wafer bumping and wafer level packaging requirements," said Mark W. Eichhorn, Corporate Vice President of Sales and Marketing.

"We are very pleased with the opening of our new Tempe, Arizona facility and the opportunity to demonstrate our plating computer to customers attending the show and our open house. This location will enable us to support local and regional customers more effectively complementing our development center in Albuquerque, New Mexico," said Steve Anderson, CEO. "Surfect is now well positioned to deliver and demonstrate process capabilities for our plating computer tool with close customer interaction for machine placements in the America's and Asia."

About Surfect Holdings, Inc.

Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single-cell electroplating tool and process that utilizes the industry's first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back-end of the semiconductor manufacturing process. Additional information is available on the Surfect Technologies website at www.surfect.com

Safe Harbor

Certain statements contained in this press release are "forward-looking statements" within the meaning of applicable federal securities laws, including, without limitation, anything relating or referring to future financial results and plans for future business development activities, and are thus prospective. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include, without limitation, the risks and uncertainties set forth from time to time in reports filed by the company with the Securities and Exchange Commission. Although the company believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward-looking statements contained herein. The company undertakes no obligation to publicly release statements made to reflect events or circumstances after the date hereof.

    Contacts

    Company
    Mark Eichhorn, Surfect Technologies, Inc.
    Email -- 
Email Contact, ph --  (215) 693-6240.

    Investor Relations
    Terry McGovern, Vision Advisors, Inc.
    Email -- 
Email Contact, ph -- (415) 902-3001
    Bryan Smyth, Smyth Consulting Group
    Email -- 
Email Contact, ph -- (858) 480-2880

    Marketing
    Jody Mahaffey, JDM Resources
    Email -- 
Email Contact, ph -- (480) 216-5049

Web site: http://www.surfect.com/