WHO: Mike Butts, a Fellow and a lead chip architect at fabless
semiconductor company, Ambric
WHAT: Mr. Butts will present his paper, "A Power-Efficient
TeraOPS IC Employs Massively-Parallel Architecture"
The press release announcing the Ambric family of chip products will
be available on Monday, October 9, 2006 at 6:00 a.m. PDT at
http://www.ambric.com/news/pr/100906.php.
WHEN: Tuesday, October 10, 2006 at 3:25 p.m. PDT in Session
Three: Multicores for Embedded Applications/Part I
WHERE: DoubleTree Hotel San Jose, 2050 Gateway Place, San Jose,
Calif.
Second Floor, Gateway Ballroom, Fir and Oak Sections
EVENT URL: http://www.instat.com/FallMPF/06/conf1.htm
CONTACT: Abbie Kendall, Armstrong Kendall, Inc., 503-672-4681,
abbie@akipr.com
About Ambric, Inc.
Ambric is a fabless semiconductor company that has developed the world's first chip to enable massively parallel software programming for complex embedded electronics systems. The company's chips deliver performance that is more than an order of magnitude higher than high-end DSPs and rivals the performance of FPGAs on many applications. Ambric products will help electronics companies accelerate time-to-market for their products while slashing their system development costs.
Established in 2003 and headquartered in Beaverton, Ore., Ambric has received funding from ComVentures, OVP Venture Partners, Northwest Technology Ventures, and private investors. Visit http://www.ambric.com for the latest news and information on the company.
Ambric, Inc. and the Ambric logo are trademarks of Ambric, Inc. All other trademarks are the property of their respective owners.
Contact:
Armstrong Kendall, Inc.
Abbie Kendall, 503-672-4681
Email Contact