"We are excited to introduce the world's first 1Gb DDR3 components," said Brian Shirley, vice president of Micron's memory group. "Micron's strength in advanced DRAM technology has given us the industry leading position in high density memory solutions."
Micron's DDR3 products will support data rates of 800 megatransfers per second (MT/s) to 1,600 MT/s with clock frequencies of 400 megahertz (MHz) to 800 MHz respectively, doubling the speed from DDR2. At DDR3's top speed, a 100,000-page document can be transferred in approximately one second. The DDR3 supply voltage has been reduced from 1.8V to 1.5V, reducing power consumption by up to 30 percent; the device is manufactured on Micron's 78nm process technology. These DDR3 benefits will help enable the next level of performance in a wide array of computing devices.
"Early 2007 should bring memory thirsty computing and consumer applications, such as Microsoft's anticipated Vista operating system. DDR3 will initially benefit the server, notebook, and desktop markets and will then reach consumer applications such as graphics and HDTV's," said Shane Rau, senior analyst of IDC, a market intelligence firm.
Evaluation samples of Micron's leading-edge 1Gb DDR3 components are available to select customers with production expected to begin early next year. Micron's 1Gb DDR3 components will be available in various output configurations (x4, x8 and x16), and will be fully compliant to the most recent JEDEC DDR3 specifications (JEDEC is the leading developer of standards for the semiconductor industry). These components will support module densities from 512 megabytes (MB) through 4 gigabytes (GB) and a variety of module types including FBDIMMs, UDIMMs, SODIMMs, and RDIMMs.
A 2Gb DDR3 device is also expected to be available from Micron early next year, helping to enable even higher density applications.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAM, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.
This press release contains forward-looking statements regarding the production of DDR3 memory. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Company files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically the Company's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.
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