Mindspeed(R) First to Support Emerging Ethernet-over-DS3/E3 Protocol with Line Card-on-a-Chip Family
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Mindspeed(R) First to Support Emerging Ethernet-over-DS3/E3 Protocol with Line Card-on-a-Chip Family

Integrated Single-Chip Solution Includes All Necessary Line Interface Units (LIUs), Paves Way for More Economical Multi-Service, Clear-Channel DS3/E3 Applications

NEWPORT BEACH, Calif.—(BUSINESS WIRE)—March 15, 2006— Mindspeed Technologies Inc. (NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced it has expanded its highly integrated DS3/E3 line card-on-a-chip (LoC) family to include products that support generic framing protocol (GFP) encapsulation for emerging Ethernet-over-DS3 applications in multi-protocol label switching (MPLS) data networks. The M2931x family is available in one- to six-port configurations and is the first Ethernet-over-DS3 solution of its kind to include integrated line interface units (LIUs).

"To make the most efficient use of their installed networks, carriers are motivated to connect Ethernet traffic by adding GFP encapsulation functionality to a variety of multi-service switching equipment including SONET/SDH add-drop multiplexers, wireless uplinks, LAN/WAN routers and media gateways," said Rammy Bahalul, senior product line manager with Mindspeed. "GFP is an efficient encapsulation protocol that enables different types of packet traffic to be mapped onto the transport network."

"Carriers and OEMs are looking for ways to create a common and more flexible Ethernet transport network using GFP encapsulation, through Ethernet-over-PDH deployment," said Ian Eigenbrod, senior research analyst with IDC. "Companies that can deliver complete DS3 LIU, framer and GFP functions will enable carriers and OEMs to provide both low-cost and highly integrated Ethernet-over-PDH solutions."

Mindspeed's M2931x chipset is a complete DS3/E3 line termination system for the physical layer. Its devices integrate up to six independent line interface units (LIUs) with built-in jitter attenuators, plus up to six companion DS3/E3 framers. In addition to supporting GFP encapsulation for Ethernet-over-pleisiochronous digital hierarchy (PDH) deployment, the M2931x also support high-level data link controller (HDLC) and asynchronous transfer mode (ATM) applications on a single data-networking platform, and each protocol can be selected on a per-port basis. M2931x-based equipment will enable carriers to add a variety of Ethernet, voice and storage services to their offerings without replacing existing metro networks.

Technical Details

The M2931x family incorporates independent system interfaces to support cell and packet termination into an industry-standard system bus of UTOPIA Level 2 (UL2) for ATM, and POS-PHY Level 2 packets and/or SPI-3 for ATM cells, HDLC and GFP packets. The LoC solution is supported by Mindspeed's telecom application package (TAP) software for PHY devices, which features a well-defined application programming interface (API) that allows easy integration with higher-level applications software to shorten the development cycle. Each M2931x channel can be turned off and tri-stated for redundancy support and power conservation. The devices require only one 19.44 MHz reference clock (passive crystal) for generating all the necessary internal line rate clocks and enabling the same reference clock to be available.

Mindspeed's M2931x family is part of a broader LoC offering that serves telecommunications, data communications and multi-service applications. The M2932x solution supports telecommunications applications requiring densities from one to 12 ports, while the M2930x solution is targeted at multi-service communications applications requiring densities from one to six ports.

The GFP-enabled one-port M29311 and two-port M29312 are available now in a 19mm plastic ball grid array (PBGA) and priced at $29 and $49 per unit, respectively, in OEM volumes of 10,000. The six-port version is available now in a 27mm plastic ball grid array (PBGA) with a price of $154 per unit in OEM volumes of 10,000.

About Mindspeed Technologies(R)

Mindspeed Technologies Inc. designs, develops and sells semiconductor networking solutions for communications applications in enterprise, access, metropolitan and wide area networks.

The company's three key product families include high-performance analog transmission and switching solutions, multi-service access products designed to support voice and data services across wireline and wireless networks, and WAN communications solutions including T/E carrier physical-layer and link-layer devices, as well as ATM/MPLS network processors.

Mindspeed's products are used in a wide variety of network infrastructure equipment including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers and digital loop carrier equipment.

To learn more, visit the company at www.mindspeed.com.

Safe Harbor Statement

This press release contains statements relating to Mindspeed, and our future results, including certain projections and business trends, that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results, and actual events that occur, may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: market demand for our new and existing products and our ability to increase our revenues; our ability to maintain operating expenses within anticipated levels; our ability to reduce our cash consumption; constraints in the supply of wafers and other product components from our third-party manufacturers; availability and terms of capital needed for our business; the ability to attract and retain qualified personnel; successful development and introduction of new products; our ability to obtain design wins and develop revenues from them; pricing pressures and other competitive factors; order and shipment uncertainty; fluctuations in manufacturing yields; product defects; and intellectual property infringement claims by others and the ability to protect our intellectual property, as well as other risks and uncertainties, including those detailed from time to time in our Securities and Exchange Commission filings.



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Mindspeed Technologies Inc. 
Tom Stites (Editorial), 949-579-3650         
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Simon Biddiscombe (Investor Relations), 949-579-6283