- Unveils most cost-effective process for systems using analog RF components
"These improvements to our core H-Series wafer fabrication processes put us ahead of the competition in terms of die efficiency, design flexibility, consistency in process technology and die size," said Dr. Peter Osborne, chief technology officer, Zarlink Analog Foundry. "Revisions to the metallization and via rules enable designers to shrink the die size and optimise the layout for very high-speed analog components."
The Zarlink Analog Foundry is benefiting from the current round of restructuring in the semiconductor industry. Some restructured foundries have caused capacity constraints for companies requiring smaller wafer runs and hard-to-manufacture specialty chips, as well as continuity-of-supply concerns. At the same time, many fabless semiconductor companies are looking for best-in- class analog solutions in order to compete with IDMs (integrated device manufacturers).
"These business conditions are creating exciting, long-term growth opportunities for our Analog Foundry," said Tony Gallagher, senior vice president, Global Operations, Zarlink Semiconductor. "We are committed to giving our many customers a competitive advantage by developing the most cost- effective, high-performance analog process technologies in the industry."
H-Series processes brought to new level of high-performance analog
The H-Series processes developed by Zarlink Analog Foundry in Swindon, UK, were first designed for analog RF components used in signal processing applications. The fully qualified improvements to H-Series processes boost the performance and lower the system cost of high-speed, high-performance consumer products and wireless applications.
The Analog Foundry's leading-edge double poly-silicon H-Series has a full complement of RF-compatible passive components including low-capacitance resistors, high-quality capacitors and inductors. These processes are ideally suited to analog applications and enable full-power, low-voltage, low-noise integrated solutions for performance analog applications up to and higher than 2.5 GHz. Details on how the new metallization and via rules improve the H-Series process are available upon request.
All the H-Series process technologies are available with full design support kits incorporating advanced component models. These comprehensive design kits assist designers in developing new products on H-Series processes and making the transition to Zarlink's processes.
Comprehensive design and technical support service is also available. The Foundry's Design Services group is a broad-based team with significant experience and expertise in silicon IC design. These include a comprehensive Autographics service, front-to-back end design solutions and ESD (electrostatic discharge) consultation. The team develops and supports a complete front-to-back end design capability on state-of-the-art, third-party CAD software tools. A complete "plug and play" design environment is offered, comprising schematic capture, layout and comprehensive DRC (design rule checking) and LVS (layout versus schematic) design verification.
Zarlink's H-Series technology is available for low-cost prototyping using a multi-project wafer processing service. For further information, visit: http://foundry.zarlink.com
Questions and requests may be directed to Email Contact or telephone at +44 1793 518 000.
About Zarlink Semiconductor
For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low- power communications. For more information, visit www.zarlink.com.
Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at www.zarlink.com or contact investor relations.
Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: rapid technological developments and changes; our ability to achieve profitability and generate positive cash flows in the future; our exposure to product warranty claims resulting from product defects or failures; our dependence on our foundry suppliers and third-party subcontractors; increasing price and product competition; our exposure to currency exchange rate fluctuations and other factors inherent in our international operations; and other factors referenced in our Annual Report on Form 20-F for the fiscal year ended March 25, 2005. Investors are encouraged to consider the risks detailed in this filing.
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