The Jazz Technology Review will provide an overview of the company's business, including its analog foundry model, new process offerings and its design kit and modeling features that enable advanced analog integration for next generation wireless, power management, high speed networking and data storage products. In addition, Jazz will feature a Question and Answer Panel on the topic of Designing and Selling Analog SOCs.
"The Technology Review will provide both our existing customers and potential business partners with a view of the latest process technologies offered by Jazz, as well as the benefits of modularity in chip design and manufacturing," said Marco Racanelli, vice president of technology and engineering, Jazz Semiconductor. "In addition to presenting an aggressive roadmap to enable next-generation RF ICs, Jazz will use this forum to provide a foundry perspective on what is being put in place to serve power management markets that are demanding high voltage technology in a pure-play model."
Among Jazz Semiconductor's new process offerings is the recently announced, industry proven 0.5 micron, 40V Bipolar-CMOS-DMOS (BCD) process targeted for power management ICs and high performance amplifiers and drivers required for consumer applications. Primarily offered exclusively by integrated device manufacturers (IDMs), BCD process technology incorporates, into a single foundry process flow, what are typically three different process types: bipolar, for analog control; CMOS, for digital control; and DMOS, for handling the high voltages required for managing on-chip or system power. This recent announcement underscores Jazz Semiconductor's commitment to expand beyond its core foundation of high speed analog and RF into the emerging power management and high voltage markets. Jazz has completed the rollout of design kits and has published its multi-project wafer (MPW) schedule for the new BCD process.
In addition, Jazz will be highlighting both its 0.13um SiGe BiCMOS processes; SBL13, which supports a low cost bipolar module for higher levels of digital integration coupled with analog and RF features for low cost wireless products, and SBC13, a fully featured SiGe BiCMOS process for higher performance, more highly integrated products. Jazz executives will also discuss the importance of accurate, comprehensive modeling in Analog and RF and how the company is bridging the design and manufacturing gap by pairing modular processes with modular design infrastructure. Jazz will elaborate on its existing Modeling and Design Kit Infrastructure and the new features and enhancements that are upcoming in 2006.
The Jazz Technology Review will be held on Tuesday, March 7, 2006 from 9 a.m. to 2 p.m. at Cadence Design Systems located at 2655 Seely Avenue, Building 5, San Jose, California, 95134. For more information or online registration, please visit the company's website at http://www.jazzsemi.com/news_events/registration.shtml.
About Jazz Semiconductor
Jazz Semiconductor is an independent pure-play wafer foundry focused primarily on specialty CMOS process technologies, including High Voltage CMOS, SiGe BiCMOS and RFCMOS for the manufacture of highly integrated analog and mixed-signal semiconductor devices. Jazz serves customers targeting wireless, optical networking, power management, consumer electronics, storage, aerospace/defense and other high-performance applications. Jazz executive offices and its U.S. wafer fabrication facilities are located in Newport Beach, Calif. The company also has engineering, manufacturing and sales support in Shanghai, China. Jazz has expanded its wafer capacity in China through manufacturing partnerships with Advanced Semiconductor Manufacturing Corporation and Hua Hong NEC Electronics Co., Ltd. For more information, please visit www.jazzsemi.com.
Contact:
Jazz Semiconductor Jessica McNaughton, 949-435-8086 Email Contact or Jazz Media Contact: Lauri Julian, 949-715-3049 Email Contact