DesignCon 2006 Conference and Exhibition Closes with Top Vendors, Industry Leaders and Record-Breaking Numbers
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DesignCon 2006 Conference and Exhibition Closes with Top Vendors, Industry Leaders and Record-Breaking Numbers

CHICAGO—(BUSINESS WIRE)—Feb. 14, 2006— Discussing globalization, solar power, women in design, usage-oriented innovation, business and strategic issues in electronic design and featuring the latest tools and products, addressing today's design challenges, the International Engineering Consortium (IEC) brought together the nation's top industry leaders and drew over 5,000 people to register for its DesignCon 2006 last week at the Santa Clara Convention Center in Silicon Valley.

A record-breaking number of 125 DesignCon exhibitors provided strong leadership and a strong presence at the event along with key sponsors Agilent Technologies (official sponsor), Rambus, BERTScope, CST, NEC, Sigrity, Tektronix, Reed Electronics Group, VPO and more.

Industry leaders shared their knowledge and experience in keynote addresses, various panels and presented their award-winning papers in comprehensive seminars. Keynoters Brian Halla (National Semiconductor), Justin Rattner (Intel Corporation) and T.J. Rogers (Cypress Semiconductors) joined other top-level executives such as Conference Chair Darlene Solomon (Agilent Laboratories), Jay Greenberg (Synopsys), Carl Guardino (Silicon Valley Leadership Group), Robert Hum (Mentor Graphics), Kathryn Kranen (Jasper Design Automation), Lucio Lanza (Lanza Technology Ventures), Belle Wei (San Jose State University) and more.

Attendee Charlie Shaffer of BERTScope noted, "DesignCon is one of the best places for learning about new tools, whether they are software tools or measurement tools... to address tough measurement and design problems. The exchange between professionals, the quality of the TecForums and the papers being presented are very high. I don't think there is another place on the planet where you can learn as much, if you are concerned about high-speed data transmission, as you can at DesignCon in a couple of days."

With a ten percent increase of registrants leading into the show, the DesignVision Awards, the premiere of the Management Forum, technology pavilions, three co-located events, TecPreviews, various poster sessions in emerging technologies, numerous technical panels and expert speakers, much activity buzzed throughout the content-filled conference and leading-edge exhibition.

The IEC's print and on-line education features content from DesignCon2006 with its publications, iForums, TecPreviews and Executive Perspectives available at www.iec.org.

Visit www.designcon.com/2006/ for additional show highlights including photos, Podcasts, news coverage and more or contact Lisa Ann Reyes at +1-312-559-3325 or lreyes@iec.org.



Contact:
International Engineering Consortium
Lisa Reyes, 312-559-3325       

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