Micron to Showcase Mobile Portfolio, Including New NAND Flash and Mobile DDR DRAM MCP, at 3GSM World Congress in Barcelona, Spain, February 13-16, 2006
BOISE, Idaho—(BUSINESS WIRE)—Feb. 1, 2006— Micron Technology, Inc. (NYSE: MU), a worldwide provider of advanced memory and image sensor solutions, today announced its new line of multichip package (MCP) memory for use in feature-rich mobile phones. Driven by the need for increased speed, extended functionality, and reduced package size, feature-rich 2.5G and 3G handset designs require flexible, high-capacity memory subsystems. By combining Micron's NAND flash memory with its Mobile DRAM featuring Endur-IC(TM) technology in the same package, designers now have a convenient option to include quality Micron memory direct from the company into their high-performance handset designs."As a complete mobile memory subsystem provider, Micron devices are increasingly capturing more property on many of today's popular mobile phones," said Achim Hill, senior director marketing for Micron's Mobile Memory Group. "To meet the market's increasing demand for high density, small form factor, and low power devices, it's a natural evolution for Micron to further support the industry by creating a powerful NAND and DRAM packaging combination."
Micron will showcase its new MCP and mobile memory portfolio at the 3GSM World Congress, held February 13-16, 2006 in Barcelona, Spain. A variety of Micron image sensor and mobile memory product demonstrations will take place at its booth on the exhibit floor in hall one, space C66.
"MCP's will continue to expand beyond wireless handsets into emerging mobile multimedia devices, further driving the need for reliable, cost-effective solutions," added Hill. "Micron can deliver design-in support across the product spectrum from die to software and packaging, offering a total quality solution."
Micron's high-quality, high-density NAND and Mobile DRAM MCP devices are currently sampling to select customers and are expected to be available in 1Gb NAND/512Mb Mobile DDR DRAM configurations for production in Q4 2006. To learn more about the value of Micron's memory solutions for the mobile industry, please contact Micron's marketing department at 208-368-3900 or visit http://www.micron.com/mobile.
About Endur-IC technology
Because greater functionality requires increased densities, DRAM is emerging as an attractive, cost-effective component in an MCP memory device. Micron's Mobile DDR DRAM features its innovative new Endur-IC(TM) technology. Endur-IC technology leverages Micron's advanced stacked processes and a combination of other unique design methodologies to deliver low power, high quality, high reliability, and overall robustness to your products.
About Micron
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND Flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Micron, the Micron orbit logo, and Endur-IC are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.
Contact:
Micron Technology, Inc. Jill Thompson, 208-368-5749 Email Contact