Spectra7 to Demonstrate 800Gbps Active Copper Interconnects with Arista, Cisco and Other Leading Ethernet Alliance Members at OFC
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Spectra7 to Demonstrate 800Gbps Active Copper Interconnects with Arista, Cisco and Other Leading Ethernet Alliance Members at OFC

SAN DIEGO, March 26, 2024 — (PRNewswire) —  (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps Active Copper Cable (ACC) interconnects connecting with Arista, Cisco and other leading equipment makers at the 2024 Optical Fiber Communication Conference and Exhibition (OFC). The demonstration will be in the Ethernet Alliance booth #1415. The premier global communications and networking expo will be held at the San Diego Convention Center, Calif., March 26-28, 2024.

Spectra7 will be demonstrating 800Gbps OSFP ACC interconnects with Arista's TH5/X93160 Ethernet switch based on Broadcom's newest Tomahawk 5 switch chip as well as 800G QSFP-DD ACC interconnects with Cisco's 64 port switch based on their own SiliconOne switch chip. In total Spectra7 will have six 800Gbps ACC interconnects in the demo connecting a wide range of switches, routers and test equipment.

Spectra7's analog based GaugeChangerâ„¢ GC1122 chips are used in 800Gbps ACCs and offer significant cost, size and energy consumption value vs. competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

ABOUT ETHERNET ALLIANCE

The Ethernet Alliance is a global consortium that includes system and component vendors, and industry experts who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education. For more information, please visit https://ethernetalliance.org.

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and a technical support location in Dongguan, China. For more information, please visit www.spectra7.com. 

Neither the TSX Venture Exchange nor its regulation services provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

CAUTIONARY NOTES

Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, the Company's strategy, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to, the risk factors discussed in the Company's management's discussion and analysis for the year ended December 31, 2022. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.

For more information, please contact:

Matt Kreps
Darrow Associates
214-597-8200
Email Contact

Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
Email Contact

Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
Email Contact 

 

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