TI Broadens RS-232 Interface Portfolio with IEC ESD Protected Devices
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TI Broadens RS-232 Interface Portfolio with IEC ESD Protected Devices

DALLAS, Sept. 13 /PRNewswire/ -- Texas Instruments Incorporated (NYSE: TXN) (TI) today introduced new RS-232 devices with system-level IEC 61000-4-2 ESD (Electrostatic Discharge) protection. Integrating IEC 61000-4-2 protection onto these devices makes the RS-232 interface immune to damage caused by ESD strikes while the system is up and running, such as when making a connection to the RS-232 cable once the system is powered up. Another significant advantage these devices provide is the elimination of external IEC ESD protection devices, saving the board manufacturer cost in assembly and board space. TI's initial device offerings with IEC ESD protection include the MAX3243E, MAX3232E and MAX3227. (See: http://focus.ti.com/docs/prod/folders/print/max3243e.html and http://focus.ti.com/docs/prod/folders/print/max3232e.html )

ESD test standards such as HBM (Human Body Model), MM (Machine Model), and CDM (Charged Device Model) address immunity from damage experienced through device handling (especially during the board manufacturing process). The IEC 61000-4-2 ESD specification is one of the industry's most stringent ESD testing methodologies to address system-level immunity to malfunction and/or damage during an ESD strike while the end equipment is in use. In comparison, other previously-mentioned ESD tests are performed with the device powered down and also at the device level. Furthermore, the stress conditions associated with the IEC ESD specification are much higher than the device- level ESD tests. For example, peak current for IEC 61000-4-2 ESD strike is five times greater than the peak current for the HBM ESD strike.

TI's MAX3243E and MAX3232E, which are compliant up to level 4 (+/- 8 kV Contact Discharge and +/- 15 kV Air Gap Discharge), and MAX3227, which performs better than the level 3 specification (+/- 6 kV Contact and +/- 8 kV Air Gap) devices, meet the requirements for low-power, high-speed applications, such as portable/consumer equipment, telecom, and computing applications. By providing ultra low-power consumption during power-down mode (ICC 1uA typ), high data-rate speeds (up to 1Mbps), and 5.5V-tolerant inputs, the devices are suitable for most RS-232 communication needs.

Packaging, Pricing, and Availability

The MAX3243E is currently available in the industry-standard 28-pin TSSOP, SSOP and SOIC packages, as well as the space-saving QFN package. All package offerings are RoHS compliant. The devices are available to sample now. Budgetary pricing for the MAX3243E is set at $1.28 for commercial temp grade and $1.57 for industrial temp grade in quantities of 1,000.

These new devices join other TI interface devices in the Standard Linear and Logic Must Have ( http://www.ti.com/musthave ) product offerings. TI's Must Have products are a select group of Standard Linear and Logic products that provide a focused priority for the customer. These devices are among TI's diverse offering of interface devices for industrial, computer, telecommunications, consumer electronics and automotive applications, empowering customers to differentiate their products and win in their markets.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com

Safe Harbor Statement

Statements contained in this press release regarding the Pb-Free, Green and RoHS compatibility status of TI products and other statements of management's beliefs, goals and expectations may be considered forward-looking statements as that term is defined in the Private Securities Litigation Reform Act of 1995, and are subject to risks and uncertainties that could cause actual results to differ materially from those expressed or implied by these statements. The following factors and the factors discussed in TI's most recent Form 10-K could cause actual results to differ materially from the statements contained in this press release: changes to the RoHS Directive or the underlying definitions or interpretations; new or different information from third parties, including TI suppliers. We disclaim any intention or obligation to update any forward-looking statements as a result of developments occurring after the date of this news release.

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Web site: http://www.ti.com/
http://focus.ti.com/docs/prod/folders/print/max3243e.html/
http://focus.ti.com/docs/prod/folders/print/max3232e.html/
http://www.ti.com/musthave/