Spectra7 and MultiLane to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects at DesignCon 2024
[ Back ]   [ More News ]   [ Home ]
Spectra7 and MultiLane to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects at DesignCon 2024

SAN JOSE, Calif., Feb. 1, 2024 — (PRNewswire) — (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and MultiLane Technologies Inc. (MultiLane), a market leading manufacturer of High-Speed IO and Data Center Interconnect test solutions, announced they will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable (ACC) products for hyperscale data center applications.

The demo will highlight Spectra7's ACCs successfully interoperating with the ML4015E Digital Sampling Oscilloscope (DSO) Test System at 112G PAM4 signaling that is used for 800Gbps port speeds. The demo will highlight a 112G PAM4 Eye Diagram showing superior signal integrity.

DesignCon is the premier high-speed interconnect and system design conference attended by engineers from around the world. The Spectra7 will be on exhibit in booth #1344.

"MultiLane prides itself on offering solutions that enable top-tier testing at a large scale," said Elias Khoury, MultiLane Product Line Manager for TDR and cable and transceiver testing. "We are delighted to be working with Spectra7 and their cable partners as they anticipate bringing their 112Gbps products to mass production in 2024."

"We are seeing significant interest from every Hyperscaler to get sample 800Gbps cables that are enabled by our new GC1122 solution", said Spectra7 CEO Raouf Halim. "MultiLane is a close and valued partner. Their validation of our technology will help accelerate the adoption of 800Gbps interconnects using our GaugeChanger GC1122 chips"

Spectra7's analog based GaugeChanger GC1122 chips are used in ACCs and offer significant cost, size, and energy consumption value versus competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

ABOUT MultiLane

MultiLane Inc. is a leading provider of High-Speed IO and Data Center Interconnect test solutions from 10G to 1.6T. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for QSFP28, QSFP-DD, OSFP, OSFP-XD and other standards. MultiLane's products are used to test semiconductors, DACs, AOCs, active cables, optical transceivers, and system switch cards. MultiLane also offers compliance test services and fully automated, turn-key test solutions. In addition, MultiLane develops high speed ATE modules that fit in wafer-scale automated test systems such as Advantest's V93000 platform. For more information, please visit www.multilaneinc.com.

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and a technical support location in Dongguan, China. For more information, please visit www.spectra7.com. 

Neither the TSX Venture Exchange nor its regulation services provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

CAUTIONARY NOTES

Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, the Company's strategy, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to, the risk factors discussed in the Company's management's discussion and analysis for the year ended December 31, 2022. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.

For more information, please contact:

Matt Kreps
Darrow Associates
214-597-8200
Email Contact

Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
Email Contact

Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com

 

Cision View original content to download multimedia: https://www.prnewswire.com/news-releases/spectra7-and-multilane-to-demonstrate-robust-performance-testing-of-800g-active-copper-interconnects-at-designcon-2024-302050495.html

SOURCE Spectra7 Microsystems Inc.

Contact:
Company Name: Spectra7 Microsystems Inc., MultiLane
Financial data for Spectra7 Microsystems Inc., MultiLane