IC’Alps joins TSMC Design Center Alliance
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IC’Alps joins TSMC Design Center Alliance

Grenoble, FRANCE – October 4, 2023 - IC’Alps, a France-based provider of ASIC Design & Supply Services, today announced that it has joined the TSMC Design Center Alliance (DCA).  As a key component of TSMC Open Innovation Platform® (OIP), the DCA program focuses on chip implementation and system level design solutions to lower the barriers for customers adopting TSMC technology. 

IC’Alps is a leading expert in analog, digital and mixed signal ASIC/SoC designs for ultra-low power, MEMS/Sensor front end, power management solutions, ultrasound, multiprocessor architectures and secured ASIC design. With a team of 85+ designers in constant growth, IC’Alps has completed numerous customer projects using TSMC process technologies from 0.18 µm to 7nm (5nm under development). As a TSMC DCA member, IC’Alps will continue to provide the high quality service to customers with the proven design tools and access through the TSMC OIP collaboration.

“Our partnership with IC’Alps will benefit our mutual customers with its high-quality ASIC/SoC development services using TSMC’s industry-leading technologies, as well as IC’Alps’ experience with European markets,” said Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC. “As a valuable design ecosystem partner, IC’Alps has extensive IC design expertise and will be able to help our customers accelerate silicon innovation for a wide range of emerging technologies.”

“With many years of practice making integrated devices using TSMC technologies, this is an exciting milestone for IC’Alps and we are very proud to be part of TSMC Design Center Alliance. We support hereafter our common customers in their ASIC design with a reassurance of meeting their needs on performance, time-to-market and budget. We will strive to honour this position,” said Lucille Engels, Chief Operating Officer of IC’Alps.

ABOUT IC’ALPS

IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Deseign Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

 

Sales Contact

sales@icalps.com

Press Contact

Emmanuel de SUREMAIN

emmanuel.desuremain@icalps.com



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