Ventec expands world class hydrocarbon PCB laminate range with new material for high-end RF and microwave applications
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Ventec expands world class hydrocarbon PCB laminate range with new material for high-end RF and microwave applications

13 December 2022 - Ventec International Group Co., Ltd. (6672 TT), has expanded its tec speed 20.0 range of hydrocarbon-based PCB materials with the new tec-speed 20.0 VTM1000i hydrocarbon laminate. Offering impressive thermal reliability and exceptionally high Dk (9.8) and low Df (0.0023) typically seen only in PTFE materials, this next generation hydrocarbon laminate presents the industry with a lower budget solution for high-end RF applications, including satellite communications and 5G RF use.

Designed for antenna and communication systems, radar, and aviation systems, tec-speed 20.0 VTM1000i is available in a range of dielectric thickness, with 0.38 mm through to 3.81 mm options and offers high decomposition temperature (Td) of 426°C.

Providing considerable power integrity benefits, the high Dk value (9.8 ± 0.0245 @ 10 Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, offering an alternative option for specific application in the microwave and RF industry previously available only through more costly PTFE laminates.

Manufactured at Ventec’s state-of-the-art facilities based in Taiwan and China, tec-speed 20.0 VTM1000i is available worldwide thanks to Ventec’s managed global supply chain, providing reliable disruption-free delivery in Asia, Europe, and the Americas.

“At Ventec we are constantly refining and improving our range to help our customers achieve their special and future performance goals. tec-speed 20.0 VTM1000i represents a top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry, and is an important addition to our tec-speed range,” commented Jason Chung, CEO of Ventec International Group. “We will be showcasing this new laminate worldwide at events throughout 2023.”

tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego on booth 419 from 24-26 January.

Ventec International is a world leader in the production of polyimide & high-reliability epoxy laminates and prepregs and a specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.

Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network.
For more information, visit www.venteclaminates.com


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Media Contact

Kim Sauer (Mr)
Global Marketing Communications
Ventec International Group

Email:  Email Contact
Mobile: +44 7906 019 022
www.venteclaminates.com