Micron's Mobile DDR products exceed the current Joint Electron Device Engineering Council (JEDEC) standard and provide leading performance with shorter latency, higher speeds, full page burst, multiple addressing options, and according to leading customers, the industry's lowest standby current. Micron leverages its stacked DRAM process technology to achieve the complete industrial temperature range, -40-degrees Celsius to +85-degrees Celsius.
"There are numerous features derived from Micron's new architecture that translate to system performance benefits for our customers, especially those customers requiring thin die specifications," said Deb Matus, Micron's Product Marketing Manager for Mobile Memory. "Micron's Mobile DDR parts demonstrate great immunity to failures arising during the manufacturing and packaging processes, making them the ideal device for die-based applications, multichip packages (MCPs), systems-in-a-package (SiPs), Package on Package (PoP) and other stacked solutions. Additionally, mobile phone manufacturers benefit from the extended battery life in standby mode given our Endur-IC technology."
As an innovative technology from Micron, Endur-IC technology is designed to address the rugged demands of the mobile market. Endur-IC technology, a combination of Micron's advanced process technology and a unique implementation of other design methodologies, provides distinct advantages to our customers in terms of low power, high quality, high reliability, and overall robustness.
Micron developed the enhanced features of this new product family to target growing mobile applications, such as; feature-rich smart phones, digital still cameras, and MP3 players by incorporating advanced processes, including Endur-IC technology. Endur-IC technology allows for a reduction of refresh current in many applications, which leads to extended battery life in standby mode. Customers also benefit from temperature compensated self refresh (TCSR) that automatically adjusts refresh according to temperature changes in the device. For further power savings, the partial array self refresh (PASR) feature allows user control of refresh conditions to extend battery life. All of these features are available to customers without requiring special software or coding, while at the same time providing compatibility with many other suppliers' parts.
"Understanding the unique memory specifications and packaging requirements of our mobile system customers, Micron developed a DRAM architecture optimized for this market segment," said Achim Hill, Micron's Senior Director of Marketing for Mobile Memory. "Achieving high speed performance, low latency and suitability for various stacking options without negatively impacting device quality and reliability were specifically emphasized in this major design thrust. And, to facilitate the design-in process with handset OEMs, we are working with leading mobile processor manufacturers to ensure compatibility between our 512Mb Mobile DDR memory and their respective devices. With the expansion of Micron's mobile product offering, we now provide industry leading volatile memory solutions with both Mobile DDR as well as our proven CellularRAM(TM) products."
Several configurations of Micron's Mobile DDR devices are available today: 128Mb in x16 and 512Mb in x16 and x32 configurations, while the availability of 256Mb devices is scheduled for the second half of 2005. Visit http://www.micron.com/mobileddr for more information on Micron's Mobile DDR product family. In addition to the introduction of the Mobile DDR family, Micron also supports a growing family of Mobile SDR devices. Reference http://www.micron.com/products/dram/mobilesdram for more information.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, Flash memory, CMOS image sensors, other semiconductor components and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron's common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit its Web site at www.micron.com.
Micron, the Micron orbit logo, and Endur-IC are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S. All other trademarks are the property of their respective owners.
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Micron Technology, Inc. Echo Chadwick, 208-368-4400 http://www.micron.com