Open-Silicon to Participate in Panel Discussions and Booth Demonstration at DAC 2017
[ Back ]   [ More News ]   [ Home ]
Open-Silicon to Participate in Panel Discussions and Booth Demonstration at DAC 2017

MILPITAS, CA--(Marketwired - June 14, 2017) - Open-Silicon, a system-optimized ASIC solution provider, today announced it will participate in two panel discussions and a booth demonstration at the 54th annual Design Automation Conference (DAC) in Austin, TX. The first panel will address the business aspects of the design IP market and the factors that are fueling its growth. The second panel will be a discussion about the challenges associated with increasingly complex SoC designs and the steps that can be taken to mitigate the challenges. Open-Silicon will also be participating in the ARM Approved Design Partner booth, where it will demonstrate its IoT Edge SoC Platform solution and showcase its IoT Gateway SoC Reference Design.

First Panel Session:

Who: Elias Lozano, Sr. Director of Business Development & IP Solutions, Open-Silicon

Title: "The IP Paradox: Growing Business Despite Consolidations"

When: Monday, June 19, 1:30pm – 3:00pm

Where: IP Track, Session 6, Ballroom G, Austin Convention Center

Abstract: Design IP has become the largest category of EDA in 2016/17 (ESD Alliance, 2016 report), growing by 10% YoY in spite of the semiconductor industry being affected by consolidation and exponential SoC development cost. What are the market forces that are fueling IP business growth? IP license price increases? Number of IPs in an SoC? Make vs buy trends? These forces can be linked with price, the number of IPs in an SoC, technology node and/or make vs buy trends. Is injection of money from international funds creating short term growth?

Second Panel Session:

Who: Elias Lozano, Sr. Director of Business Development & IP Solutions, Open-Silicon

Title: "Identifying the Major Challenges Facing SoC Designs Before 2020"

When: Monday, June 19, 3:00pm – 4:00pm

Where: ChipEstimate.com booth number 347

Abstract: ARM Approved Design Partners will discuss what they believe will be their major challenges in SoC design over the next three years. The design partners will draw upon their own experiences in dealing with increasingly complex technology, customers' growing expectations and the challenges of new sectors, such as IoT, to identify the main issues. The partners will also be asked to share what steps they think should be taken to address the problems they have highlighted.

Participation in ARM Approved Design Partner Booth

As an ARM Approved Design Partner for full turnkey ASIC solutions, Open-Silicon will participate in the ARM Approved Design Partner booth at DAC.

When: Monday, June 19, 10:00am – 2:00pm

Where: ARM booth number 729

What:

  • ARM® Cortex®-M basedIoT Edge SoC Platform Demonstration – This demonstration shows the end-to-end communication between sensor hubs and the cloud through a gateway device. Depending upon the type of radio technology, the sensor hubs can be used outdoors, on the factory floor or inside a room. The industrial IoT system setup is a part of Open-Silicon's Spec2Chip IoT SoC Platform, which allows IoT edge custom SoC designs to be evaluated at the system level.
  • ARM® Cortex®-A9 basedIoT Gateway SoC Reference Design Demonstration – This demonstration shows the IoT Gateway SoC Reference Design, which is built for smart city applications such as smart homes, smart waste management, smart transport, smart traffic, smart parking, smart lighting, smart metering and more. The gateway is a full featured device that supports various types of wireless and wireline connectivity, communicates with IoT edge devices and connects to the cloud through 3G/LTE/WiFi. Open-Silicon's smart city IoT system setup is a part of Open-Silicon's Spec2Chip IoT SoC Platform, which allows IoT gateway custom SoC designs to be evaluated at the system level.

About Open-Silicon

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system, software and IP -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world. To learn more, visit www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.



Contact Information:

Purvi Shenoy
Open-Silicon
408-240-5772

Email contact

Media Contact: Jennifer DeAnda 208-794-7113 Email contact