RESEARCH TRIANGLE PARK, N.C. – Nov. 29, 2011 – Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology for 3-D ICs on Dec. 14 at the RTI conference on 3-D Architectures for Semiconductor Integration and Packaging in Burlingame, Calif. 

His presentation, “Applications Driving Adoption of Low Temperature Direct Bond Technology for 3-D Integrated Circuits,” will include:

• Low temperature direct bond technology with and without 3-D interconnect
• Scaling advantages of low-temperature direct bond technology
• Implementation of low-temperature direct bond technology
• Early adopter applications
• Volume manufacturing adoption

The conference is Dec. 12-14 at the Hyatt Regency San Francisco Airport Hotel in Burlingame.  Dr. Enquist will be available for interviews during the show or by phone following the event. Contact Sarah-Lyle Dampoux, Email Contact, phone: +33 1 58 18 59 30

About Ziptronix

Ziptronix is a pioneer in the development of low-temperature direct bond technology for a variety of semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D integrated circuits. Itspatented, scalable 3D-integration technology, including ZiBondTM and DBI®, provides the lowest-cost bonding solution for 3D technology, while enabling size reduction, yield enhancement, lower production costs and power consumption, and increased system performance. The company holds more than 35 U.S. patents and more than 20 international patents in nine foreign countries and Europe. It has more than 45 U.S. and international patent applications pending. Ziptronix licenses its technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and assembly facilities, and operates a back-end-of-line R&D facility with 6,000 square feet (557m2) of Class 100/1000 cleanroom space at its headquarters in Research Triangle Park, N.C. Ziptronix was founded in 2000 as a venture-backed spinoff of RTI International. Visit www.ziptronix.com

Contact:

Sarah-Lyle Dampoux

Email Contact 

phone: +33 1 58 18 59 30