STMicroelectronics Maximizes Power Savings and Reliability Benefits of Industry-Standard Memory Monitoring and Protection

Combined SPD-EEPROM and temperature monitor for DDR3 DRAM modules meets JEDEC TSE2002, with 30% better current consumption than competing devices

GENEVA, March 8 — (PRNewswire) — STMicroelectronics (NYSE: STM), a leader in analog ICs, has introduced the STTS2002, an integrated Serial Presence Detect (SPD) EEPROM memory and temperature-monitoring IC. The protection device meets the latest JEDEC TSE2002 standard for DDR3 DRAM modules featured in computing products ranging from ultra-mobile devices to high-performance servers.

The STTS2002 combines accurate temperature sensing with the functions of the SPD EEPROM, which stores the memory module's characteristics, as specified by JEDEC TSE2002. The temperature sensor enables the CPU and chipset in the system to apply Closed-Loop Thermal Throttling (CLTT) when the temperature of the DDR3 DIMM modules exceeds a pre-programmed threshold value. The CLTT prevents overheating of the memory modules, thereby assuring reliability and optimal power consumption. As system designers specify progressively higher-capacity, faster DRAMs within more miniaturized product form factors, memory modules have an increased risk of overheating. CLTT dynamically slows data transactions if excessive temperature is detected. This reduces the memory's power consumption until the temperature returns to within an acceptable range.

The STTS2002 meets the form, function and performance requirements of JEDEC TSE2002, communicating SPD and temperature data over an industry-standard System Management Bus (SMBus) interface. However, by consuming 30% less current than competing devices, it can be implemented with lower impact on the overall system power budget.

Key features of the STTS2002 are:

  • 0.25 degrees C temperature resolution
  • +/-1 degrees C accuracy over specified temperature range (+75 degrees C to +95 degrees C)
  • 2.3 to 3.6V operation
  • 2Kbit serial SPD EPPROM: non-modifiable in end-user application
  • Same 2 x 3mm TDFN 8-pin package and pinout as JEDEC-specified SPD-only IC
  • SMBus 2.0 Timeout protocol support
  • Multi-mode, open-drain EVENT output pin
  • Functionally and plug-in backwards compatible to the STTS424E02 in existing applications

Joining ST's established STTS424E02 combined SPD-EEPROM and temperature monitor meeting JEDEC JC42.4 for 3.3V DRAM modules, the 2.3V STTS2002 is available for immediate sampling and production delivery, in the JEDEC-specified 2x3x0.8mm TDFN8 package. Pricing begins at $0.40 for orders over 10,000 pieces.

Further information is available at www.st.com/temp-sensors

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company's net revenues were $8.51 billion. Further information on ST can be found at www.st.com.  

SOURCE STMicroelectronics

Contact:
STMicroelectronics
Michael Markowitz of STMicroelectronics
Phone: +1-781-591-0354
Email Contact
Web: http://www.st.com

Featured Video
Editorial
Roberto FrazzoliEDACafe Editorial
by Roberto Frazzoli
Innovations from the 2024 TSMC Technology Symposium
More Editorial  
Latest Blog Posts
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Real Intent’s Prakash Narain on Growing into Management Role
Jean-Marie BrunetSiemens EDA
by Jean-Marie Brunet
Facing a New Age of IC Design Challenges Part 1
Anupam BakshiAgnisys Automation Review
by Anupam Bakshi
The Role of the Portable Stimulus Standard in VLSI Development
Jobs
Senior SOC Design Engineer for Nvidia at Santa Clara, California
Hardware System Engineer for Google at Mountain View, California
Technical Staff Engineer - Hardware (FPGA) for Microchip at San Jose, California
RF Design Engineer for Blockwork IT at San Francisco, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Post Silicon Hardware Engineer for Nvidia at Santa Clara, California
Upcoming Events
SEMICON Southeast Asia 2024 at MITEC Kuala Lumpur Malaysia - May 28 - 30, 2024
3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024
2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024
Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise