"We've worked long and hard on this version of PakSi-E and have made significant strides to keep it at the forefront of complex package, SiP and PCB analysis," affirms Dave DeMaria, Optimal's chief executive officer. "These new capabilities offer a major step forward to a unified analysis environment for signal, power and thermal integrity."
PakSi-E's performance has been improved by approximately 3X across a range of designs with no sacrifice in accuracy. Other improvements include a newly integrated CAD front-end, an overhauled and modernized graphical user interface (GUI), and Linux and 64-bit support.
Performance Improvements
As package, SiP and PCB designs become faster and more complex, it is crucial that analysis tools must keep pace. PakSi-E's performance has improved by up to 3X across a range of designs with no sacrifice in accuracy, as compared to previous releases.
An output from PakSi-E is an RLGC SPICE model used for circuit simulation. The circuit simulation performance of this model has been improved by the suppression of small mutual C and K values during model generation.
Productivity Enhancements
IC packages, SiPs and PCBs are designed using an array of different computer aided design (CAD) tools. PakSi-E joins the rest of Optimal's products in using the same front-end for importing CAD designs. This common front-end supports varied CAD import, 2D and 3D visualization of the design, what-if editing of design data and setup for analysis. Additionally, the PakSi-E GUI has been revamped with a modern Windows look and feel and an intuitive organization of tasks to improve ease of use, while tasks have been streamlined for minimal setup. With this common look and feel and use model, the user's learning curve is reduced when moving from one Optimal tool to another.
PCB design nets are inherently multi-port. With increasing use of multi-chip packaging, these multi-port nets are finding their way into SiPs. PakSi-E supports automated assignment of multi-port pins, as well as the ability to specify which circuit branches need to be analyzed.
Analysis setup has been further optimized by allowing for the merger of small segments in the design, speeding downstream meshing and analysis.
If an analysis was stopped or aborted, upon re-starting, PakSi-E will prompt the user to resume analysis, enhancing software reliability for large, complex designs with runtimes that can take hours or days.
Allowing companies to take advantage of low-cost PC hardware, PakSi-E is available on Windows and Red Hat Enterprise Linux versions 3 and 4 operating systems. It can handle larger, more complex designs due to 64-bit support on both Windows and Linux.
The Optimal 3D power and signal integrity analysis tools for IC Package, SiP and PCB design will be demonstrated in Booth #3063 during the 44th Design Automation Conference (DAC) June 4-8 at the San Diego Convention Center in San Diego, Calif.
Pricing, Availability, New Platform Support
The latest version of PakSi-E is shipping now and is available at no extra charge to customers with maintenance contracts. Integrated with all major IC Package and PCB design flows, new seat pricing starts at $25,000 (U.S.) for a one-year term license.
For more information, contact Jamie Metcalfe, Optimal's vice president of Business Development, who can be reached at (978) 808-0509 or via email at jamiem@optimalcorp.com.
About Optimal Corporation
Optimal Corporation is a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Its innovative solutions enable design teams to concurrently analyze and optimize the IC with the package and the packaged IC on the PCB. By providing high-performance, ease-of-use and pinpoint accuracy, Optimal's solutions allow engineers to quickly create designs optimized for power and signal integrity. Through seamless integration with all of the major CAD design flows, its solutions help customers achieve fast and efficient design time. Optimal's technology is embedded within the Cadence Allegro design flow and endorsed in the TSMC Reference Flow. Optimal, founded in 1995, is a TSMC Technology Alliance Partner and a member of the Cadence Connections Emerging Solutions Program. Optimal Corporation is located at: 6980 Santa Teresa Blvd., Suite 100, San Jose, Calif. 95119-1346. Telephone: 408-363-6300. Facsimile: 408-363-6305. Email: info@optimatlcorp.com. For more information, visit: www.optimalcorp.com.
Optimal Corporation and the Optimal logo are trademarks of Optimal Corporation. Optimal Corporation acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
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