New Silicon Value Announces Technical Seminar Series

Presents Automated Alternative for Designing ASICs at Half the Die Size


CUPERTINO, California - January 30, 2002 - New Silicon Value, plc., a provider of ultra-high density full-custom ASICs for consumer and communications applications, today detailed plans for a technical seminar series, entitled, "Size Matters! Designing the Same ASIC at ½ the Die Size." These free seminars will present a breakthrough automated full-custom ASIC design solution that overcomes the limitations of cell-based ASICs to deliver as much as 2x improvement in density, a 2x increase in performance, and a 50% reduction in power consumption over other ASIC approaches. Complete agenda and registration information is available at www.silicon-value.com.

The New Silicon Value "Size Matters" seminars will take place in Santa Clara, California on February 5, at the Techmart Meeting Center; in San Diego, California on February 12, at the San Diego Wyndham Hotel; and in Bedford, Massachusetts on February 14, at the Renaissance Hotel. The events will feature presentations from senior executives and technical experts. In addition, at the Santa Clara event, Bill Jennings, vice president of Internet systems business unit at Cisco, Inc., will present a case study demonstrating Cisco's engagement with New Silicon Value to deliver a highly complex chip currently in production.

About ASiX™
New Silicon Value's ASiX™ technology optimizes deep submicron designs at the RTL, gate, layout, transistor, and interconnect levels, enabling rapid integration and timing closure of highly complex chips at as low as half the cost of those designed using traditional cell-based techniques. ASiX™ design technology has been used to deliver many high end ASICs to major customers worldwide.

About New Silicon Value
New Silicon Value plc, a subsidiary of Zen Research plc (LSE: ZEN), is a leading ASIC manufacturer that specializes in ultra-high performance and ultra-high-density ASICs targeted for communications and consumer applications. Its breakthrough full-custom design technology, the ASiXTM, enables quick integration and timing closure of complex, high-performance designs in small silicon areas - often as small as half the die size of other cell-based ASICs. This results in significant reductions in manufacturing costs; integration of much more circuitry on single chips; higher performance; lower power consumption and faster time-to-market. New Silicon Value plc has offices in Cupertino, California; Boxboro, Massachusetts; and Jerusalem, Israel.


Editorial Contacts:

Thomas Blaesi
New Silicon Value, plc.
+1 (408) 863 2783
Email Contact

Mark Way
Zen Research plc
+44 (20) 7382 0470
Email Contact

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This media advisory contains forward-looking statements regarding among other things the future success of New Silicon Value's ASiX ™ chip design technology and other aspects of New Silicon Value technology. These forward-looking statements are based on current expectations and are subject to risks and uncertainties. Actual events and results may differ materially from those described in these forward-looking statements, as a result of several factors, including the successful implementation of New Silicon Value technology, the ability of New Silicon Value to successfully market and sell its products under current market conditions, and other risk factors.

ASiX and SiliconMaster are registered trademarks of New Silicon Value, Inc. All other product names or company names are mentioned for identification purposes only, and may be trademarks of their respective owners.

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