Qualcomm Snapdragon 450 Mobile Platform to Bring 14nm FinFET Process, Enhanced Dual-Camera Support and Fast LTE Connectivity to Mid-Range Smartphones and Tablets

SHANGHAI, June 28, 2017 — (PRNewswire) —  At Mobile World Congress Shanghai 2017, Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the Qualcomm® Snapdragon™ 450 Mobile Platform, a new entry to the Snapdragon 400 Mobile Platform tier. Catered to mid-range smartphones and tablets, the Snapdragon 450 is the first in its tier to use 14nm FinFET process and is designed to deliver significant improvements in battery life, graphics and compute performance, imaging and LTE connectivity over its predecessor, the Snapdragon 435 Mobile Platform.

The full release is available on the Qualcomm News Center website at https://www.qualcomm.com/news/releases/2017/06/28/qualcomm-snapdragon-450-mobile-platform-bring-14nm-finfet-process-enhanced

About Qualcomm

Qualcomm's technologies powered the smartphone revolution and connected billions of people. We pioneered 3G and 4G – and now we are leading the way to 5G and a new era of intelligent, connected devices. Our products are revolutionizing industries, including automotive, computing, IoT, healthcare and data center, and are allowing millions of devices to connect with each other in ways never before imagined. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, all of our engineering, research and development functions, and all of our products and services businesses, including, our QCT semiconductor business. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.

Qualcomm Contacts:
Pete Lancia, Corporate Communications
Phone: 1-858-845-5959
Email:  Email Contact

John Sinnott, Investor Relations
Phone: 1-858-658-4813
Email: Email Contact

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/qualcomm-snapdragon-450-mobile-platform-to-bring-14nm-finfet-process-enhanced-dual-camera-support-and-fast-lte-connectivity-to-mid-range-smartphones-and-tablets-300480874.html

SOURCE Qualcomm Technologies, Inc.

Contact:
Qualcomm Technologies, Inc.

Featured Video
Jobs
Senior SOC Design Engineer for Nvidia at Santa Clara, California
Senior DPU System Application Engineer for Nvidia at Santa Clara, California
Hardware System Engineer for Google at Mountain View, California
RF Design Engineer for Blockwork IT at San Francisco, California
Advanced Mechanical Engineer for General Dynamics Mission Systems at Marion, Virginia
Senior Post Silicon Hardware Engineer for Nvidia at Santa Clara, California
Upcoming Events
3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024
2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024
Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024
SemiconWest - 2024 at Moscone Center San Francisco CA - Jul 9 - 11, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise