Microsemi Names Intercomp as New SoC FPGA-specialized Sales Representative in Central Europe

Agreement Provides Extensive FPGA Design and Technical Support Expertise to Support Customers Using Microsemi's Mainstream FPGA Solutions and Adds Additional Resources to Meet Increased Sales Demand

NUREMBERG, Germany, Feb. 26, 2014 — (PRNewswire) —  Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has signed a sales representative agreement with Intercomp. Intercomp is specifically tasked with strategically supporting Microsemi's increased sales demand for its mainstream FPGA solutions within the Central European market, which includes a growing list of new and existing customers.

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)

Microsemi's award-winning SmartFusion®2 SoC FPGA and IGLOO®2 FPGA product lines with their extensive range of mainstream features are an outstanding solution for system architects, FPGA designers and system designers that are diligently trying to differentiate their end products in their target markets. The company's FPGA devices provide the lowest power consumption, best-in-class security technology and highest reliability in their class of products; features that allow OEMs to considerably differentiate their products from the competition and gain significant market advantage.

"The combined strengths of Microsemi's mainstream FPGA product portfolio and Intercomp's extensive experience supporting mainstream FPGA customers in Central Europe will open tremendous new sales opportunities in a host of new markets and applications," said Rainer J. Klink, general partner, Intercomp.

Microsemi selected Intercomp for its strong FPGA-related design, product and market expertise, substantial technical understanding of Microsemi's FPGA product lines, well-established sales relationships, and extensive overall FPGA market knowledge. Microsemi will utilize Intercomp's proven technical sales experience to expand its technical sales support for this important market segment and augment current sales and distribution channels in the region.

"We are experiencing significant customer design activity and interest in Microsemi's SmartFusion2 SoC FPGAs and IGLOO2 FPGAs on a worldwide basis," said Eric van der Heijden, vice president of EMEA sales at Microsemi. "With Intercomp as a strategic member of our highly-technical sales channel, Microsemi is well-positioned to make an even greater impact by tapping into Intercomp's customer base and vast market experience in Central Europe." 

"We are committed to supporting Microsemi with our extensive sales relationships in Central Europe," added Jens Becker, general manager sales, Intercomp. "Our customers recognize how Microsemi's innovative mainstream FPGA technologies and its unique differentiating features can add significant value for OEMs while providing the best total cost of ownership and overall time-to-market benefits."

For more information on Microsemi's mainstream FPGA solutions visit www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2 for SmartFusion2 SoC FPGAs and http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga for IGLOO2 FPGAs. The company's sales team can also be reached via email at Email Contact.

To contact an Intercomp representative in Central Europe email Email Contact or call: +49 89 8006 5190.

About SmartFusion2 SoC FPGAs
Award-winning SmartFusion2 SoC FPGAs integrate inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip. Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications.

About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.

About Intercomp
From the very beginning, our corporate self-concept was to establish the most effective sales organization in the local Semiconductor market. Since 1992, we are successfully active as the leading "System Solutions & Semiconductor Sales Representative" in Central Europe. We fully understand the necessity of aligning the objectives of our represented manufacturers with the interests/needs of our customers in order to achieve ultimate success for all business partners.

Intercomp acts as a link between our customers and Manufacturers resources by actively developing and driving the symbiotic relationship between all parties involved. Thus, we have established a strong network, invaluable customer relationships and extensive market knowledge in Central Europe.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time;  voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new sales agreement with Intercomp, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

MSCCIR

SOURCE Microsemi Corporation

Contact:
Microsemi Corporation
Intercomp
Farhad Mafie, VP Worldwide Product Marketing, 949.380.6161
Beth P. Quezada, Communications Specialist, 949.380.6102, Email: Email Contact
Web: http://www.microsemi.com

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