MagnaChip to Include Specialty High Density Capacitor Processes With Its Standard CMOS Mixed Signal Process

SEOUL, South Korea, Sept. 12, 2011 — (PRNewswire) — MagnaChip Semiconductor Corporation ("MagnaChip Semiconductor") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed signal semiconductor products, today announced that it will offer high density metal-insulator-metal capacitor and deep trench capacitor processes for integration into MagnaChip's standard CMOS mixed signal process.

The high density metal-insulator-metal capacitor process provides capacitance values of 4, 6, 8, and 10fF/um(2). This process replaces the industry standard silicon nitride insulator layer with a high dielectric constant material layer in order to achieve high capacitance per unit area while suppressing leakage current. This high density capacitor can substantially reduce die area in applications that need high total capacitance for the purpose of charge storage and noise decoupling.

The deep trench capacitor consists of an array of small deep trenches constructed into the silicon substrate. This 3-D capacitor has high capacitance of 22 fF/um(2) and breakdown voltage of 25V. This process is specifically optimized to make series resistance low enough for fast switching applications and will be released for production in December 2011.

TJ Lee, Senior Vice President and General Manager of MagnaChip's Corporate and SMS Engineering stated, "We are very pleased to announce the offering of our specialty capacitor processes such as high density MIM capacitor and deep trench capacitor for feature-rich and cost-effective mixed signal applications. Our goal is to continue to develop highly differentiated and cost-effective technology solutions to meet the increasing application specific needs of our foundry customers."

About MagnaChip Semiconductor

Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor has one of the broadest and deepest range of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise.

CONTACTS:


In the United States:

In Korea:

Robert Pursel

Chankeun Park

Director of Investor Relations

Senior Manager, Public Relations

Tel. 408-625-1262

Tel. +82-2-6903-3195

Email Contact

Email Contact





SOURCE MagnaChip Semiconductor Corporation

Contact:
MagnaChip Semiconductor Corporation
Web: http://www.magnachip.com

Featured Video
Latest Blog Posts
Vijay ChobisaSiemens EDA
by Vijay Chobisa
The Rise of Custom Acceleration
Bob Smith, Executive DirectorBridging the Frontier
by Bob Smith, Executive Director
Nomination Deadline for Phil Kaufman Award and Hall of Fame: June 30
Jobs
Hardware Engineer for PTEC Solutions at Fremont, California
Senior DPU System Application Engineer for Nvidia at Santa Clara, California
Design Verification Engineer for Blockwork IT at Milpitas, California
Senior Post Silicon Hardware Engineer for Nvidia at Santa Clara, California
Upcoming Events
Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024
SemiconWest - 2024 at Moscone Center San Francisco CA - Jul 9 - 11, 2024
Flash Memory 2024 Conference & Expo FMS2024 at Santa Clara Convention Center Santa Clara CA - Aug 6 - 8, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering TechJobsCafe - Technical Jobs and Resumes GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise