Juliano Mologni, Lead Product Manager ANSYS

Chris Giovanniello, SVP Sales & Marketing Menlo Micro

Codasip’s Brett Cline on Custom Compute and CHERI Codasip

EDACafe Editorial by Roberto Frazzoli New chiplet description standard; AMD’s AI acceleration roadmap; Ultra Accelerator Link; 3-layer CMOS image sensors

Bridging the Frontier by Paul Cohen Playing Catch with Robots at SEMI’s ASMC 2024

Siemens EDA by Jean-Marie Brunet Facing a New Age of IC Design Challenges Part 2

The Dominion of Design by Sanjay Gangal Unleashing New Horizons: Gemini Era Ushers in Revolutionary AI Developments at Google I/O

Agnisys Automation Review by Anupam Bakshi The Role of the Portable Stimulus Standard in VLSI Development

Hardware Engineer for PTEC Solutions at Fremont, California

Senior Post Silicon Hardware Engineer for Nvidia at Santa Clara, California

Senior CAD Engineer for Nvidia at Santa Clara, California

RF Design Engineer for Blockwork IT at San Francisco, California

Advanced Mechanical Engineer for General Dynamics Mission Systems at Marion, Virginia

Design Verification Engineer for Blockwork IT at Milpitas, California

3D & Systems Summit - Heterogeneous Systems for the Intelligently Connected Era at Hilton Dresden Hotel An der Frauenkirche 5, 01067 Dresden Germany - Jun 12 - 14, 2024

2024 IEEE Symposium on VLSI Technology & Circuits at HILTON HAWAIIAN VILLAGE HONOLULU HI - Jun 16 - 20, 2024

Design Automation Conference (DAC) 2024 at Moscone West, San Francisco CA - Jun 23 - 27, 2024

SemiconWest - 2024 at Moscone Center San Francisco CA - Jul 9 - 11, 2024